
AMD Xilinx
XC6VCX195T-1FF1156C
XC6VCX195T-1FF1156C ECAD Model
XC6VCX195T-1FF1156C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 199680 | |
Number of CLBs | 15600 | |
Combinatorial Delay of a CLB-Max | 790 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VCX195T-1FF1156C Datasheet Download
XC6VCX195T-1FF1156C Overview
The XC6VCX195T-1FF1156C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL languages, and is capable of handling complex tasks. This chip model is becoming increasingly popular in the industry, as it is highly reliable and has a wide range of applications.
The XC6VCX195T-1FF1156C chip model is capable of handling a variety of tasks, from low-level embedded processing to high-end digital signal processing. It is highly reliable and efficient, and can easily be integrated into existing systems. It can be used for a variety of tasks, such as image processing, video processing, audio processing, and more.
In order to ensure the best performance of the XC6VCX195T-1FF1156C chip model, it is important to understand the specific design requirements and product description of the chip model. This includes understanding the specific features of the chip, the available configuration options, and the available tools and software. Additionally, it is important to understand the industry trends and future development of related industries, as well as whether the application environment requires the support of new technologies.
When designing with the XC6VCX195T-1FF1156C chip model, it is important to consider the potential risks associated with the design. This includes understanding the potential hardware and software compatibility issues, as well as understanding the potential security risks associated with the design. Additionally, it is important to understand the potential environmental and energy requirements of the design.
By understanding the specific design requirements and product description of the XC6VCX195T-1FF1156C chip model, as well as the industry trends and future development of related industries, designers can create reliable and efficient designs that are tailored to their specific needs. Additionally, designers can use actual case studies and precautions to ensure the best performance of the chip model.
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