AMD Xilinx
XC6VCX130T-2FF784I
XC6VCX130T-2FF784I ECAD Model
XC6VCX130T-2FF784I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FF784I Datasheet Download
XC6VCX130T-2FF784I Overview
The XC6VCX130T-2FF784I chip is a high-performance digital signal processing chip designed for embedded processing, image processing, and other applications that require the use of HDL language. It is a powerful tool for engineers and developers to create innovative and efficient products.
The XC6VCX130T-2FF784I chip is part of the industry trend of advanced digital signal processing and embedded processing. Its application environment requires the support of new technologies such as artificial intelligence, machine learning, and cloud computing. This chip is capable of performing complex tasks, such as facial recognition, natural language processing, and image processing.
The XC6VCX130T-2FF784I chip has the potential to be used in a wide range of network applications. It can be used to build intelligent systems, such as smart home systems, autonomous vehicles, and robotics. This chip can also be used to create more efficient and secure networks, as well as to provide better services and enhanced user experiences.
The XC6VCX130T-2FF784I chip is a powerful tool for developing advanced digital signal processing systems. It is capable of performing complex tasks, such as facial recognition, natural language processing, and image processing. This chip is part of the industry trend of advanced digital signal processing and embedded processing, and it has the potential to be used in a wide range of network applications. As the technology continues to advance, this chip will become even more powerful and versatile, allowing for more efficient and secure networks, as well as better services and enhanced user experiences. The XC6VCX130T-2FF784I chip is the perfect tool for engineers and developers to create innovative and efficient products in the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||