AMD Xilinx
XC6VCX130T-2FF784C
XC6VCX130T-2FF784C ECAD Model
XC6VCX130T-2FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FF784C Datasheet Download
XC6VCX130T-2FF784C Overview
The XC6VCX130T-2FF784C is a powerful chip model developed by Xilinx. It is a Field Programmable Gate Array (FPGA) that is designed to provide a wide range of features and capabilities for a variety of applications. The design intention of the XC6VCX130T-2FF784C is to provide a highly efficient, cost-effective, and reliable solution for advanced communication systems. This chip model can be used in a variety of scenarios, from basic network communication to complex intelligent systems.
The XC6VCX130T-2FF784C can be used for a variety of applications in the era of fully intelligent systems. It can be used for advanced network communication, such as High-Speed Interconnects (HSI) and Ethernet. It can also be used for intelligent applications such as machine learning and artificial intelligence. The chip model also supports a wide range of intelligent robots, from simple robotic arms to autonomous drones.
The XC6VCX130T-2FF784C can also be used for the development and popularization of future intelligent robots. It provides a wide range of features and capabilities that can be used to create advanced robots. It has the ability to process and analyze data quickly, as well as to control robotic movements accurately. In order to use this chip model effectively, technical talents such as software engineers and electrical engineers are needed.
In conclusion, the XC6VCX130T-2FF784C is a powerful chip model that is designed for advanced communication systems. It can be used for a variety of applications in the era of fully intelligent systems, from basic network communication to advanced intelligent robots. Furthermore, it requires technical talents such as software engineers and electrical engineers in order to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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