
AMD Xilinx
XC6VCX130T-2FF1156I
XC6VCX130T-2FF1156I ECAD Model
XC6VCX130T-2FF1156I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 128000 | |
Number of CLBs | 10000 | |
Combinatorial Delay of a CLB-Max | 910 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC6VCX130T-2FF1156I Datasheet Download
XC6VCX130T-2FF1156I Overview
The Xilinx XC6VCX130T-2FF1156I chip model is a state-of-the-art FPGA device that offers a wide variety of features and benefits for users. This chip model is ideal for applications in the industrial, automotive, medical, and aerospace industries, as it provides high performance, low power consumption, and a small form factor.
The original design intention of the XC6VCX130T-2FF1156I is to provide a flexible and reliable platform for the development of advanced communication systems. This chip model is designed to be highly scalable, allowing users to easily upgrade their systems as their needs change. It is also designed to be compatible with a wide range of communication protocols, including Ethernet, USB, and Bluetooth.
The XC6VCX130T-2FF1156I chip model offers a number of advantages over other FPGA devices. It is designed to be highly efficient, with a power consumption of only 0.75 W, and it is capable of providing up to 6.3 Gbps of data throughput. It also supports a wide range of communication protocols, including Ethernet, USB, and Bluetooth. Additionally, the chip model is designed to be highly reliable, with a maximum operating temperature of 85°C and a maximum operating frequency of up to 200 MHz.
In terms of expected demand trends for the XC6VCX130T-2FF1156I chip model, it is expected to be in high demand in the coming years. This is due to the increasing need for advanced communication systems in the industrial, automotive, medical, and aerospace industries. Additionally, the chip model is expected to be used in a wide range of applications, from consumer electronics to automotive systems.
The product description and specific design requirements of the XC6VCX130T-2FF1156I chip model are as follows. It is designed to be highly efficient, with a power consumption of only 0.75 W and a maximum operating temperature of 85°C. It is capable of providing up to 6.3 Gbps of data throughput, and it is compatible with a wide range of communication protocols, including Ethernet, USB, and Bluetooth. Additionally, it is designed to be highly reliable, with a maximum operating frequency of up to 200 MHz.
In terms of actual case studies, the XC6VCX130T-2FF1156I chip model has been used in a variety of applications, from consumer electronics to automotive systems. For example, it has been used in the development of advanced driver assistance systems, such as lane departure warning systems and adaptive cruise control. Additionally, it has been used in the development of medical imaging systems, such as ultrasound and CT scanners.
When using the XC6VCX130T-2FF1156I chip model, it is important to take into account the specific design requirements and precautions. It is important to ensure that the device is properly cooled and that the power supply is adequate. Additionally, it is important to ensure that the device is properly programmed and that the communication protocols are compatible with the application. Finally, it is important to ensure that the device is properly tested and verified before being used in a production environment.
Overall, the Xilinx XC6VCX130T-2FF1156I chip model is a state-of-the-art FPGA device that offers a wide variety of features and benefits for users. It is designed to be highly efficient and reliable, and it is capable of providing up to 6.3 Gbps of data throughput. It is expected to be in high demand in the coming years, due to the increasing need for advanced communication systems in the industrial, automotive, medical, and aerospace industries. It is important to take into account the specific design requirements and precautions when using the device, as well as actual case studies, in order to ensure that the device is properly used in a production environment.
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