XC6VCX130T-2FF1156I
XC6VCX130T-2FF1156I
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rohs

AMD Xilinx

XC6VCX130T-2FF1156I


XC6VCX130T-2FF1156I
F20-XC6VCX130T-2FF1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC6VCX130T-2FF1156I ECAD Model


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XC6VCX130T-2FF1156I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 128000
Number of CLBs 10000
Combinatorial Delay of a CLB-Max 910 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC6VCX130T-2FF1156I Datasheet Download


XC6VCX130T-2FF1156I Overview



The Xilinx XC6VCX130T-2FF1156I chip model is a state-of-the-art FPGA device that offers a wide variety of features and benefits for users. This chip model is ideal for applications in the industrial, automotive, medical, and aerospace industries, as it provides high performance, low power consumption, and a small form factor.


The original design intention of the XC6VCX130T-2FF1156I is to provide a flexible and reliable platform for the development of advanced communication systems. This chip model is designed to be highly scalable, allowing users to easily upgrade their systems as their needs change. It is also designed to be compatible with a wide range of communication protocols, including Ethernet, USB, and Bluetooth.


The XC6VCX130T-2FF1156I chip model offers a number of advantages over other FPGA devices. It is designed to be highly efficient, with a power consumption of only 0.75 W, and it is capable of providing up to 6.3 Gbps of data throughput. It also supports a wide range of communication protocols, including Ethernet, USB, and Bluetooth. Additionally, the chip model is designed to be highly reliable, with a maximum operating temperature of 85°C and a maximum operating frequency of up to 200 MHz.


In terms of expected demand trends for the XC6VCX130T-2FF1156I chip model, it is expected to be in high demand in the coming years. This is due to the increasing need for advanced communication systems in the industrial, automotive, medical, and aerospace industries. Additionally, the chip model is expected to be used in a wide range of applications, from consumer electronics to automotive systems.


The product description and specific design requirements of the XC6VCX130T-2FF1156I chip model are as follows. It is designed to be highly efficient, with a power consumption of only 0.75 W and a maximum operating temperature of 85°C. It is capable of providing up to 6.3 Gbps of data throughput, and it is compatible with a wide range of communication protocols, including Ethernet, USB, and Bluetooth. Additionally, it is designed to be highly reliable, with a maximum operating frequency of up to 200 MHz.


In terms of actual case studies, the XC6VCX130T-2FF1156I chip model has been used in a variety of applications, from consumer electronics to automotive systems. For example, it has been used in the development of advanced driver assistance systems, such as lane departure warning systems and adaptive cruise control. Additionally, it has been used in the development of medical imaging systems, such as ultrasound and CT scanners.


When using the XC6VCX130T-2FF1156I chip model, it is important to take into account the specific design requirements and precautions. It is important to ensure that the device is properly cooled and that the power supply is adequate. Additionally, it is important to ensure that the device is properly programmed and that the communication protocols are compatible with the application. Finally, it is important to ensure that the device is properly tested and verified before being used in a production environment.


Overall, the Xilinx XC6VCX130T-2FF1156I chip model is a state-of-the-art FPGA device that offers a wide variety of features and benefits for users. It is designed to be highly efficient and reliable, and it is capable of providing up to 6.3 Gbps of data throughput. It is expected to be in high demand in the coming years, due to the increasing need for advanced communication systems in the industrial, automotive, medical, and aerospace industries. It is important to take into account the specific design requirements and precautions when using the device, as well as actual case studies, in order to ensure that the device is properly used in a production environment.



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