AMD Xilinx
XC6VCX130T-2FF1156C
XC6VCX130T-2FF1156C ECAD Model
XC6VCX130T-2FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-2FF1156C Datasheet Download
XC6VCX130T-2FF1156C Overview
The XC6VCX130T-2FF1156C chip model is a high-performance digital signal processor that is suitable for a wide range of applications, including embedded processing, image processing, and other digital signal processing tasks. It is designed to be used with the HDL language, which allows users to easily and quickly develop their own programs and applications.
The XC6VCX130T-2FF1156C chip model was designed with the intention of providing a powerful and reliable platform for digital signal processing. It is capable of being upgraded in the future to meet the changing needs of users. This chip model is also capable of being used in advanced communication systems, such as networks and intelligent systems. It is capable of supporting the development of complex applications and protocols, making it an ideal choice for the era of fully intelligent systems.
The XC6VCX130T-2FF1156C chip model is capable of being applied to a wide range of scenarios, including intelligent scenarios. It is capable of being used in applications that require high-performance digital signal processing and embedded processing, as well as image processing. It is also capable of being used in networks and advanced communication systems. The chip model is also capable of being used in the era of fully intelligent systems, making it an ideal choice for those looking for a powerful and reliable platform for digital signal processing.
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5,348 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,150.5402 | $1,150.5402 |
| 10+ | $1,138.1688 | $11,381.6880 |
| 100+ | $1,076.3118 | $107,631.1800 |
| 1000+ | $1,014.4548 | $507,227.4000 |
| 10000+ | $927.8550 | $927,855.0000 |
| The price is for reference only, please refer to the actual quotation! | ||