AMD Xilinx
XC6VCX130T-1FF784I
XC6VCX130T-1FF784I ECAD Model
XC6VCX130T-1FF784I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-1FF784I Datasheet Download
XC6VCX130T-1FF784I Overview
The chip model XC6VCX130T-1FF784I is a versatile and powerful integrated circuit that is well-suited for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using Hardware Description Language (HDL) and is capable of being upgraded in the future.
The XC6VCX130T-1FF784I has the capability to be applied to advanced communication systems. It has the potential to be used in the development and popularization of future intelligent robots, as it can provide the necessary computing power and flexibility.
In order to use the XC6VCX130T-1FF784I effectively, a range of technical skills are needed. In addition to a thorough understanding of HDL programming, knowledge of computer architecture and electronics is also important. Furthermore, an understanding of robotics, artificial intelligence, and machine learning is required for the development of intelligent robots.
Overall, the XC6VCX130T-1FF784I is a powerful and versatile chip that is well-suited for a range of applications. Its ability to be programmed using HDL and its potential for future upgrades make it an ideal choice for communication systems and intelligent robotics. With the right technical skills and knowledge, this chip model can be used to create powerful and innovative solutions.
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4,719 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,169.9363 | $1,169.9363 |
| 10+ | $1,157.3563 | $11,573.5632 |
| 100+ | $1,094.4565 | $109,445.6520 |
| 1000+ | $1,031.5567 | $515,778.3600 |
| 10000+ | $943.4970 | $943,497.0000 |
| The price is for reference only, please refer to the actual quotation! | ||