AMD Xilinx
XC6VCX130T-1FF784C
XC6VCX130T-1FF784C ECAD Model
XC6VCX130T-1FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-1FF784C Datasheet Download
XC6VCX130T-1FF784C Overview
The Xilinx XC6VCX130T-1FF784C is a revolutionary chip model that has been designed to meet the ever-growing demands of modern industries. It is a versatile chip model that has the potential to be used in a wide range of applications and is highly flexible, making it the perfect choice for many industries.
The XC6VCX130T-1FF784C is designed to be highly efficient and reliable, allowing for a great deal of flexibility and scalability. It is capable of supporting a wide range of communications protocols and can be used in both wired and wireless networks. It is also capable of handling a variety of applications, including voice, video, data, and multimedia.
The XC6VCX130T-1FF784C is also designed to be easily upgradable, allowing users to keep up with the latest technology and trends. This makes it ideal for use in advanced communication systems, as it can easily be upgraded to meet the changing needs of the industry. It is also capable of being used in the era of fully intelligent systems, as it can be used to support the latest AI applications.
The XC6VCX130T-1FF784C is also designed to support a wide range of network applications, making it an ideal choice for many industries. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. Additionally, it can be used in a variety of industrial applications, such as automation, robotics, and industrial IoT.
The XC6VCX130T-1FF784C is expected to be in high demand in the future, as it is designed to meet the growing needs of modern industries. It is a highly efficient and reliable chip model that is capable of supporting a wide range of applications and is easily upgradable, making it the perfect choice for many industries. It is also capable of being used in the era of fully intelligent systems, making it an ideal choice for many industries.
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2,317 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $835.7947 | $835.7947 |
| 10+ | $826.8077 | $8,268.0768 |
| 100+ | $781.8725 | $78,187.2480 |
| 1000+ | $736.9373 | $368,468.6400 |
| 10000+ | $674.0280 | $674,028.0000 |
| The price is for reference only, please refer to the actual quotation! | ||