XC6VCX130T-1FF1156I
XC6VCX130T-1FF1156I
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rohs

AMD Xilinx

XC6VCX130T-1FF1156I


XC6VCX130T-1FF1156I
F20-XC6VCX130T-1FF1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC6VCX130T-1FF1156I ECAD Model


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XC6VCX130T-1FF1156I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 128000
Number of CLBs 10000
Combinatorial Delay of a CLB-Max 790 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
ECCN Code 3A991.D

XC6VCX130T-1FF1156I Datasheet Download


XC6VCX130T-1FF1156I Overview



Chip model XC6VCX130T-1FF1156I is a model released by Xilinx, a leading provider of programmable logic devices. It is a field programmable gate array (FPGA) designed to meet the needs of high performance computing. It is a high-performance device that can be used to implement complex logic operations, and can be used in a wide range of applications, including industrial automation, medical equipment, and consumer electronics.


The XC6VCX130T-1FF1156I chip model has several advantages that make it attractive to businesses. Firstly, it is designed with a low power consumption, which makes it efficient and cost-effective to use. Secondly, the chip model is highly customizable and can be programmed to meet the needs of specific applications. Thirdly, it supports a wide range of instructions, which makes it suitable for a variety of applications. Finally, it has a high clock speed, which makes it suitable for applications that require fast processing.


In terms of industry trends, the XC6VCX130T-1FF1156I chip model is expected to be in high demand in the future. This is due to the increasing need for high performance computing, as well as the need for customizability and cost-effectiveness. The chip model is also expected to be used in the development of intelligent robots, as it is capable of providing the necessary computing power and flexibility.


In terms of the application environment, the XC6VCX130T-1FF1156I chip model can be used in a variety of environments. However, it is important to note that the chip model may require the support of new technologies in order to be used effectively. For example, the chip model may need to be integrated with other components such as sensors, actuators, and communication systems in order to be used in the development of intelligent robots.


In order to effectively use the XC6VCX130T-1FF1156I chip model, technical talents with knowledge in the areas of programming, robotics, and embedded systems are required. These technical talents should have a thorough understanding of the chip model and its capabilities, as well as the different technologies that are needed to use it effectively. Additionally, they should be familiar with the different programming languages and tools that are used to program the chip model. With the right skills and knowledge, these technical talents can help businesses develop and deploy intelligent robots and other applications that require the use of the XC6VCX130T-1FF1156I chip model.



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