AMD Xilinx
XC6VCX130T-1FF1156C
XC6VCX130T-1FF1156C ECAD Model
XC6VCX130T-1FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX130T-1FF1156C Datasheet Download
XC6VCX130T-1FF1156C Overview
The XC6VCX130T-1FF1156C is a powerful and versatile chip model that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is capable of performing complex operations with minimal energy consumption. It is also capable of handling high-speed data and providing reliable results.
The XC6VCX130T-1FF1156C is powered by a Field Programmable Gate Array (FPGA) that is programmed using the Hardware Description Language (HDL). This allows the chip to be programmed to meet the specific needs of the user. The chip is also equipped with a powerful memory controller that allows it to handle large amounts of data efficiently.
The XC6VCX130T-1FF1156C is expected to become increasingly popular in the future as the demand for high-performance digital signal processing, embedded processing, and image processing continues to grow. This chip model is capable of providing reliable results at a low cost, making it an attractive option for many businesses.
The XC6VCX130T-1FF1156C is also expected to be used in a variety of network applications in the future. It can be used in a variety of intelligent scenarios such as autonomous vehicles, intelligent surveillance systems, and smart home systems. As the world moves towards a more connected and intelligent future, this chip model will be an invaluable tool for businesses and individuals alike.
The XC6VCX130T-1FF1156C is capable of handling complex operations and is expected to be an important component of fully intelligent systems in the future. It is capable of providing reliable results at a low cost, making it an attractive option for many businesses. This chip model is expected to become increasingly popular in the coming years as the demand for high-performance digital signal processing, embedded processing, and image processing continues to grow.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||