AMD Xilinx
XC6SLX9-N3CSG324I
XC6SLX9-N3CSG324I ECAD Model
XC6SLX9-N3CSG324I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 200 | |
| Number of Outputs | 200 | |
| Number of Logic Cells | 9152 | |
| Number of CLBs | 715 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 715 CLBS | |
| Clock Frequency-Max | 806 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| Length | 15 mm | |
| Seated Height-Max | 1.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX9-N3CSG324I Datasheet Download
XC6SLX9-N3CSG324I Overview
The XC6SLX9-N3CSG324I chip model is a powerful and versatile device that is suitable for a wide range of applications. It is designed for high-performance digital signal processing (DSP), embedded processing, image processing, and other applications that require the use of HDL language. It is also equipped with the necessary features to facilitate future upgrades and the addition of advanced communication systems.
The XC6SLX9-N3CSG324I features a low-power and low-cost design, making it an ideal choice for embedded systems. It has a maximum clock frequency of 200 MHz, a 32-bit processor, and a maximum of 676 I/O pins. It also features a wide range of peripherals, including a 10/100 Ethernet MAC, two USB 2.0 ports, an SD/MMC controller, and a CAN controller. Additionally, it has an integrated FPGA, which allows for the implementation of custom logic and system-level design.
The XC6SLX9-N3CSG324I is also equipped with a variety of design tools that make it easy to develop applications for this chip. It includes a complete set of development tools, including a C compiler, an assembler, a debugger, and a simulator. Additionally, it also includes a library of pre-defined functions and macros, making it easy to create custom applications.
The XC6SLX9-N3CSG324I is a powerful and versatile device that can be used in a variety of applications. However, it is important to note that the device is not suitable for all applications and should be used with caution. It is important to thoroughly research the application requirements and the device's capabilities before making a purchase. Additionally, it is also important to ensure that the device is properly configured and that all necessary components are included. Finally, it is also important to consider the potential for future upgrades and modifications, as the device may need to be adapted to meet changing requirements.
You May Also Be Interested In
4,838 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $31.5010 | $31.5010 |
| 10+ | $31.1622 | $311.6224 |
| 100+ | $29.4686 | $2,946.8640 |
| 1000+ | $27.7750 | $13,887.5200 |
| 10000+ | $25.4040 | $25,404.0000 |
| The price is for reference only, please refer to the actual quotation! | ||