AMD Xilinx
XC6SLX25-L1CSG324C
XC6SLX25-L1CSG324C ECAD Model
XC6SLX25-L1CSG324C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 226 | |
| Number of Outputs | 226 | |
| Number of Logic Cells | 24051 | |
| Number of CLBs | 1879 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1879 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| Length | 15 mm | |
| Seated Height-Max | 1.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX25-L1CSG324C Datasheet Download
XC6SLX25-L1CSG324C Overview
The XC6SLX25-L1CSG324C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to provide high performance and reliability, and its use requires the use of HDL language. This chip model is a great choice for those who want to build advanced communication systems, networks, and intelligent scenarios.
The XC6SLX25-L1CSG324C chip model is designed to be flexible and upgradeable. It can be used in a wide range of applications, from basic communication systems to more advanced scenarios. It is capable of handling complex tasks such as image processing and digital signal processing, and can be used in the era of fully intelligent systems.
The XC6SLX25-L1CSG324C chip model is an ideal choice for those who need to build advanced communication systems. It is designed to provide high performance and reliability, and it is capable of handling complex tasks such as image processing and digital signal processing. It is also capable of being upgraded to meet the demands of future applications. It is also capable of being used in the era of fully intelligent systems, allowing for efficient and secure communication between devices.
In conclusion, the XC6SLX25-L1CSG324C chip model is a great choice for those who need to build advanced communication systems, networks, and intelligent scenarios. It is designed to be flexible and upgradeable, and it is capable of handling complex tasks such as image processing and digital signal processing. It is also capable of being used in the era of fully intelligent systems, allowing for efficient and secure communication between devices.
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3,500 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $35.4665 | $35.4665 |
| 10+ | $35.0851 | $350.8512 |
| 100+ | $33.1783 | $3,317.8320 |
| 1000+ | $31.2715 | $15,635.7600 |
| 10000+ | $28.6020 | $28,602.0000 |
| The price is for reference only, please refer to the actual quotation! | ||