AMD Xilinx
XC6SLX75T-N3CSG484C
XC6SLX75T-N3CSG484C ECAD Model
XC6SLX75T-N3CSG484C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 292 | |
| Number of Outputs | 292 | |
| Number of Logic Cells | 74637 | |
| Number of CLBs | 5831 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5831 CLBS | |
| Clock Frequency-Max | 806 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC6SLX75T-N3CSG484C Datasheet Download
XC6SLX75T-N3CSG484C Overview
The chip model XC6SLX75T-N3CSG484C has been a major player in the chip industry for many years. Manufactured by Xilinx, the model is a Field Programmable Gate Array (FPGA) designed with the intention of providing users with the ability to customize and configure their hardware to their exact specifications. This model is capable of handling complex digital and analog designs, making it suitable for a variety of applications.
The XC6SLX75T-N3CSG484C model is designed with the latest technologies, making it suitable for applications that require high performance, low power consumption and flexibility. It is also capable of supporting the development of new technologies, such as artificial intelligence, machine learning, and 5G communication. This makes it a great choice for those looking to create advanced communication systems and intelligent robots.
The XC6SLX75T-N3CSG484C model can be used to create advanced communication systems, such as 5G, as well as intelligent robots. In order to use the model effectively, users need to have a good understanding of the technologies involved, including digital signal processing, embedded systems, and computer architecture. In addition, users should also be familiar with the design process, as well as the programming language used to configure the model.
As the chip industry continues to evolve, the XC6SLX75T-N3CSG484C model is likely to remain a key player. It is capable of supporting the development of new technologies, and its flexibility makes it suitable for a variety of applications. The model is also easily upgradable, allowing users to keep up with the latest industry trends. With the right technical talents, the XC6SLX75T-N3CSG484C model can be used to create advanced communication systems and intelligent robots, making it a great choice for those looking to stay ahead of the curve.
You May Also Be Interested In
1,815 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $134.6646 | $134.6646 |
| 10+ | $133.2166 | $1,332.1655 |
| 100+ | $125.9765 | $12,597.6522 |
| 1000+ | $118.7365 | $59,368.2460 |
| 10000+ | $108.6005 | $108,600.4500 |
| The price is for reference only, please refer to the actual quotation! | ||