AMD Xilinx
XC6SLX150-N3CSG484C
XC6SLX150-N3CSG484C ECAD Model
XC6SLX150-N3CSG484C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 338 | |
| Number of Outputs | 338 | |
| Number of Logic Cells | 147443 | |
| Number of CLBs | 11519 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11519 CLBS | |
| Clock Frequency-Max | 806 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6SLX150-N3CSG484C Datasheet Download
XC6SLX150-N3CSG484C Overview
The XC6SLX150-N3CSG484C chip model is a powerful and versatile model that is becoming increasingly popular in the fields of networks, intelligent systems, and robotics. This chip model is ideal for applications requiring high-performance computing and data processing capabilities, making it an ideal choice for many industries.
The XC6SLX150-N3CSG484C chip model offers a variety of advantages for its users. It is capable of providing high-speed data processing and communication, which is essential for the development of efficient and reliable networks. Additionally, it is capable of handling large amounts of data, making it suitable for applications such as artificial intelligence (AI) and machine learning. Furthermore, it is capable of providing low power consumption, which is essential for the development of energy-efficient networks.
As the demand for the XC6SLX150-N3CSG484C chip model increases, so do the possibilities for its future applications. It is likely to be used in networks and intelligent systems, with the potential to be applied to the development of fully intelligent systems. This could involve the implementation of AI and machine learning capabilities, as well as the development of autonomous robots.
The XC6SLX150-N3CSG484C chip model is also likely to be used in the development and popularization of future intelligent robots. This could involve the implementation of AI and machine learning capabilities, as well as the development of autonomous robots. In order to effectively use the model, technical talents such as software engineers, computer scientists, and robotics engineers will be required.
In conclusion, the XC6SLX150-N3CSG484C chip model offers a variety of advantages and is likely to be used in the development of networks, intelligent systems, and robotics in the future. It is capable of providing high-speed data processing and communication, as well as low power consumption. In order to use the model effectively, technical talents such as software engineers, computer scientists, and robotics engineers will be required.
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5,213 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $122.8344 | $122.8344 |
| 10+ | $121.5136 | $1,215.1360 |
| 100+ | $114.9096 | $11,490.9600 |
| 1000+ | $108.3056 | $54,152.8000 |
| 10000+ | $99.0600 | $99,060.0000 |
| The price is for reference only, please refer to the actual quotation! | ||