XC4VLX160-12FF1513C
XC4VLX160-12FF1513C
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rohs

AMD Xilinx

XC4VLX160-12FF1513C


XC4VLX160-12FF1513C
F20-XC4VLX160-12FF1513C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1513
FBGA-1513

XC4VLX160-12FF1513C ECAD Model


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XC4VLX160-12FF1513C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 960
Number of Outputs 960
Number of Logic Cells 152064
Number of CLBs 16896
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 16896 CLBS
Clock Frequency-Max 1.205 GHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1513
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1513
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1513,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-1513
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 1513
ECCN Code 3A001.A.7.A

XC4VLX160-12FF1513C Datasheet Download


XC4VLX160-12FF1513C Overview



The XC4VLX160-12FF1513C chip model is a high-performance, low-power field programmable gate array (FPGA) manufactured by Xilinx. It is suitable for digital signal processing, embedded processing, image processing, and other applications that require high-performance, low-power operation. This chip model utilizes the HDL (Hardware Description Language) to program the chip, allowing for a wide range of applications.


The XC4VLX160-12FF1513C chip model has the potential to be used in a variety of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, for example, for autonomous vehicle navigation, facial recognition, and other AI-driven applications. The chip model can also be used to improve the performance of existing networks and systems, such as in the Internet of Things (IoT), where the FPGA can be used to increase the speed and accuracy of data processing.


When designing with the XC4VLX160-12FF1513C chip model, it is important to consider the product specifications and design requirements. These include the number of logic cells, the number of memory blocks, the maximum frequency, the power consumption, and other specifications. Additionally, it is important to consider the cost of the product, as well as the availability of the necessary components.


Case studies can be used to gain insight into the design and implementation of the XC4VLX160-12FF1513C chip model. These studies can provide valuable information about the chip model’s performance, power consumption, and other factors. Additionally, case studies can provide insight into potential pitfalls that should be avoided when designing with the chip model.


When working with the XC4VLX160-12FF1513C chip model, it is important to take precautions to ensure a successful design. This includes verifying the design with simulations, testing the design with hardware, and ensuring that the design meets the product specifications and design requirements. Additionally, it is important to use the appropriate tools and methods to ensure that the design is optimized for the desired application.


In conclusion, the XC4VLX160-12FF1513C chip model is a powerful, low-power FPGA that can be used in a variety of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, and can also be used to improve the performance of existing networks and systems. It is important to consider the product specifications and design requirements when designing with the chip model, as well as to take precautions to ensure a successful design. Case studies can provide valuable insight into the design and implementation of the chip model.



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