
AMD Xilinx
XC4VLX160-12FF1513C
XC4VLX160-12FF1513C ECAD Model
XC4VLX160-12FF1513C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 960 | |
Number of Outputs | 960 | |
Number of Logic Cells | 152064 | |
Number of CLBs | 16896 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 16896 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1513 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1513 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1513,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-1513 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 1513 | |
ECCN Code | 3A001.A.7.A |
XC4VLX160-12FF1513C Datasheet Download
XC4VLX160-12FF1513C Overview
The XC4VLX160-12FF1513C chip model is a high-performance, low-power field programmable gate array (FPGA) manufactured by Xilinx. It is suitable for digital signal processing, embedded processing, image processing, and other applications that require high-performance, low-power operation. This chip model utilizes the HDL (Hardware Description Language) to program the chip, allowing for a wide range of applications.
The XC4VLX160-12FF1513C chip model has the potential to be used in a variety of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, for example, for autonomous vehicle navigation, facial recognition, and other AI-driven applications. The chip model can also be used to improve the performance of existing networks and systems, such as in the Internet of Things (IoT), where the FPGA can be used to increase the speed and accuracy of data processing.
When designing with the XC4VLX160-12FF1513C chip model, it is important to consider the product specifications and design requirements. These include the number of logic cells, the number of memory blocks, the maximum frequency, the power consumption, and other specifications. Additionally, it is important to consider the cost of the product, as well as the availability of the necessary components.
Case studies can be used to gain insight into the design and implementation of the XC4VLX160-12FF1513C chip model. These studies can provide valuable information about the chip model’s performance, power consumption, and other factors. Additionally, case studies can provide insight into potential pitfalls that should be avoided when designing with the chip model.
When working with the XC4VLX160-12FF1513C chip model, it is important to take precautions to ensure a successful design. This includes verifying the design with simulations, testing the design with hardware, and ensuring that the design meets the product specifications and design requirements. Additionally, it is important to use the appropriate tools and methods to ensure that the design is optimized for the desired application.
In conclusion, the XC4VLX160-12FF1513C chip model is a powerful, low-power FPGA that can be used in a variety of networks and intelligent scenarios. It can be used in the era of fully intelligent systems, and can also be used to improve the performance of existing networks and systems. It is important to consider the product specifications and design requirements when designing with the chip model, as well as to take precautions to ensure a successful design. Case studies can provide valuable insight into the design and implementation of the chip model.
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