AMD Xilinx
XC4VLX100-11FF1513C
XC4VLX100-11FF1513C ECAD Model
XC4VLX100-11FF1513C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 960 | |
| Number of Outputs | 960 | |
| Number of Logic Cells | 110592 | |
| Number of CLBs | 12288 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12288 CLBS | |
| Clock Frequency-Max | 1.205 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1513 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1513 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1513,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1513 | |
| Pin Count | 1513 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC4VLX100-11FF1513C Datasheet Download
XC4VLX100-11FF1513C Overview
The XC4VLX100-11FF1513C chip model is a highly advanced semiconductor device designed to meet the needs of high-performance digital signal processing, embedded processing, image processing and other related industrial applications. It is manufactured using Field Programmable Gate Array (FPGA) technology and requires the use of HDL language for programming.
The XC4VLX100-11FF1513C chip model offers a number of advantages that make it an attractive choice for many industries. It provides high speed and low power consumption, making it an ideal choice for applications that require high performance, while also providing the flexibility to be easily reconfigured to meet changing needs. Additionally, the chip model is designed to be upgradeable, allowing it to keep up with the latest advances in technology.
The XC4VLX100-11FF1513C chip model is expected to see increasing demand in the coming years as more industries recognize its potential for providing high-performance solutions. Its ability to be upgraded and reconfigured makes it a great choice for applications that require frequent changes, such as those in the medical, automotive, and telecommunications industries. Additionally, its flexibility and scalability make it an ideal candidate for advanced communication systems, such as 5G networks.
The XC4VLX100-11FF1513C chip model was designed with the intention of providing a flexible, high-performance solution for a variety of industrial applications. Its upgradeable nature and scalability make it a great choice for applications that require frequent changes, while its low power consumption and high speed make it an ideal choice for applications that require high performance. As technology advances and the demand for high-performance solutions increases, the XC4VLX100-11FF1513C chip model is expected to remain a popular choice for many industries in the future.
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4,189 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,980.5458 | $2,980.5458 |
| 10+ | $2,948.4970 | $29,484.9696 |
| 100+ | $2,788.2526 | $278,825.2560 |
| 1000+ | $2,628.0082 | $1,314,004.0800 |
| 10000+ | $2,403.6660 | $2,403,666.0000 |
| The price is for reference only, please refer to the actual quotation! | ||