AMD Xilinx
XC4VFX140-11FFG1517I
XC4VFX140-11FFG1517I ECAD Model
XC4VFX140-11FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 142128 | |
| Number of CLBs | 15792 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 15792 CLBS | |
| Clock Frequency-Max | 1.181 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4VFX140-11FFG1517I Datasheet Download
XC4VFX140-11FFG1517I Overview
The chip model XC4VFX140-11FFG1517I has been widely used in the field of communications and computing. It is a product of the Xilinx Virtex-4 family, which is a high-performance, low-power FPGA chip. The chip model XC4VFX140-11FFG1517I features a wide range of features and capabilities, including a high-speed system bus, advanced power management, and multi-core processing. It also has a wide range of I/O options, including USB, Ethernet, and PCI Express.
The chip model XC4VFX140-11FFG1517I is designed to meet the needs of communications and computing applications. It is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. The model is also designed to be flexible and easily upgradable, allowing customers to upgrade their systems as their needs change. Additionally, the model is designed to be compatible with a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth.
The chip model XC4VFX140-11FFG1517I is expected to remain a popular choice for communications and computing applications in the future. The model is designed to be highly reliable, and its low-power consumption makes it an ideal choice for applications that require long-term operation. Additionally, its wide range of features and capabilities make it a great choice for applications that require advanced communication systems.
In terms of industry trends, the chip model XC4VFX140-11FFG1517I is expected to remain a popular choice in the future. Its advanced features and capabilities make it an ideal choice for applications that require advanced communication systems. Additionally, its low-power consumption makes it an ideal choice for applications that require long-term operation.
The original design intention of the chip model XC4VFX140-11FFG1517I was to provide high-performance, low-power, and cost-effective solutions for a variety of applications. The model is designed to be flexible and easily upgradable, allowing customers to upgrade their systems as their needs change. Additionally, the model is designed to be compatible with a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth.
In terms of future upgrades, the chip model XC4VFX140-11FFG1517I may be able to be used in advanced communication systems. The model is designed to be highly reliable, and its low-power consumption makes it an ideal choice for applications that require long-term operation. Additionally, its wide range of features and capabilities make it a great choice for applications that require advanced communication systems.
In conclusion, the chip model XC4VFX140-11FFG1517I is a highly reliable, low-power, and cost-effective solution for a variety of applications. It is expected to remain a popular choice in the future, and its advanced features and capabilities make it an ideal choice for applications that require advanced communication systems. Additionally, the model is designed to be flexible and easily upgradable, allowing customers to upgrade their systems as their needs change. With its wide range of features and capabilities, the chip model XC4VFX140-11FFG1517I is well-suited for a variety of applications and is expected to remain a popular choice for communications and computing applications in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||