AMD Xilinx
XC4VFX100-12FFG1517C
XC4VFX100-12FFG1517C ECAD Model
XC4VFX100-12FFG1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 768 | |
| Number of Outputs | 576 | |
| Number of Logic Cells | 94896 | |
| Number of CLBs | 10544 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 10544 CLBS | |
| Clock Frequency-Max | 1.181 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC4VFX100-12FFG1517C Datasheet Download
XC4VFX100-12FFG1517C Overview
The chip model XC4VFX100-12FFG1517C is a cutting-edge technology that has been developed by Xilinx, a leading semiconductor company. This particular chip model is a high-performance, low-power FPGA (Field Programmable Gate Array) that is designed to meet the needs of a wide range of industries. It is designed to be used in a variety of different applications, including communications, industrial automation, and medical imaging.
The XC4VFX100-12FFG1517C has several key advantages that make it a desirable choice for many applications. It is capable of providing high performance and low power consumption, which makes it an ideal choice for applications that require high speed and low power consumption. Additionally, it is highly configurable, allowing users to customize the chip to meet their specific needs. It also supports a wide range of communication protocols, including Ethernet, USB, and CAN.
In terms of industry trends, the XC4VFX100-12FFG1517C is expected to be in high demand in the future. This is due to the fact that it is capable of providing high performance and low power consumption, which makes it ideal for a wide range of applications. Additionally, the chip is highly configurable and supports a wide range of communication protocols, making it suitable for a variety of applications.
In terms of future applications, the XC4VFX100-12FFG1517C is expected to be used in a variety of networked and intelligent scenarios. This includes applications such as edge computing, industrial automation, and medical imaging. Additionally, it is expected to be used in the era of fully intelligent systems, as it is capable of providing high performance and low power consumption.
Overall, the XC4VFX100-12FFG1517C is a cutting-edge technology developed by Xilinx that is designed to meet the needs of a wide range of industries. It is capable of providing high performance and low power consumption, while also being highly configurable and supporting a wide range of communication protocols. It is expected to be in high demand in the future, and it is expected to be used in a variety of networked and intelligent scenarios, as well as in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||