AMD Xilinx
XC3SD3400A-5CS484C
XC3SD3400A-5CS484C ECAD Model
XC3SD3400A-5CS484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 309 | |
| Number of Outputs | 249 | |
| Number of Logic Cells | 53712 | |
| Number of Equivalent Gates | 3400000 | |
| Number of CLBs | 5968 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5968 CLBS, 3400000 GATES | |
| Clock Frequency-Max | 280 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC3SD3400A-5CS484C Datasheet Download
XC3SD3400A-5CS484C Overview
The XC3SD3400A-5CS484C chip model is a revolutionary development in the world of microcontroller technology. It is a low-power, high-performance, and low-cost solution for a variety of applications. It is designed to be used in embedded systems, such as automotive, industrial, and medical applications.
The original design intention of the XC3SD3400A-5CS484C chip model was to provide a versatile and cost-effective solution for embedded systems. It is designed to be compatible with a wide range of communication systems, such as CAN, Ethernet, and Wi-Fi. It also has an integrated memory controller and an integrated power controller to reduce power consumption.
The XC3SD3400A-5CS484C chip model is capable of being upgraded to meet the needs of advanced communication systems. It is capable of supporting multiple protocols, such as CAN, Ethernet, Wi-Fi, and Bluetooth. It also supports a variety of encryption algorithms, such as AES, RSA, and ECC.
The XC3SD3400A-5CS484C chip model is also suitable for use in networks and intelligent scenarios. It is capable of supporting multiple protocols, such as CAN, Ethernet, Wi-Fi, and Bluetooth, and it can be used to control and monitor devices remotely. Furthermore, it is capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT).
The product description of the XC3SD3400A-5CS484C chip model includes its features, such as its low-power consumption, high-performance, and low-cost solution for embedded systems. It is also compatible with multiple communication protocols, such as CAN, Ethernet, Wi-Fi, and Bluetooth. Furthermore, it has an integrated memory controller and an integrated power controller to reduce power consumption.
In terms of actual case studies and precautions, it is important to note that the XC3SD3400A-5CS484C chip model is only suitable for use in embedded systems. It is not suitable for use in desktop or laptop computers, as it is not designed for that purpose. Furthermore, it is important to ensure that the chip model is installed and configured correctly, as improper installation and configuration can lead to performance issues.
In conclusion, the XC3SD3400A-5CS484C chip model is a revolutionary development in the world of microcontroller technology. It is designed to be used in embedded systems and is capable of being upgraded to meet the needs of advanced communication systems. It is also suitable for use in networks and intelligent scenarios, and it can be used in the era of fully intelligent systems. It is important to note that the chip model should be installed and configured correctly, as improper installation and configuration can lead to performance issues.
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3,705 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $110.4096 | $110.4096 |
| 10+ | $109.2224 | $1,092.2240 |
| 100+ | $103.2864 | $10,328.6400 |
| 1000+ | $97.3504 | $48,675.2000 |
| 10000+ | $89.0400 | $89,040.0000 |
| The price is for reference only, please refer to the actual quotation! | ||