AMD Xilinx
XC3SD1800A-5CS484C
XC3SD1800A-5CS484C ECAD Model
XC3SD1800A-5CS484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 309 | |
| Number of Outputs | 249 | |
| Number of Logic Cells | 37440 | |
| Number of Equivalent Gates | 1800000 | |
| Number of CLBs | 4160 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4160 CLBS, 1800000 GATES | |
| Clock Frequency-Max | 280 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | CSBGA-484 | |
| Pin Count | 484 |
XC3SD1800A-5CS484C Datasheet Download
XC3SD1800A-5CS484C Overview
Chip model XC3SD1800A-5CS484C is a low-power, high-performance FPGA from Xilinx, Inc. It is designed for use in a variety of applications, including embedded systems, industrial control, automotive, and consumer electronics. The chip model provides a wide range of features and performance, including high-speed logic, low-power operation, and configurable I/O.
The chip model XC3SD1800A-5CS484C has several advantages over similar products in the market. It features an advanced architecture that combines low-power operation with high-speed logic, allowing it to be used in a variety of applications. Additionally, the chip model has a wide range of configurable I/O that can be used to support a variety of applications.
The demand for chip model XC3SD1800A-5CS484C is expected to increase in the near future due to its advanced features and performance. It is well-suited for use in a variety of applications, including embedded systems, industrial control, automotive, and consumer electronics. Additionally, its low-power operation and configurable I/O make it a great choice for applications that require high-speed logic and low-power operation.
The chip model XC3SD1800A-5CS484C can be used in a variety of intelligent scenarios, including networks, smart homes, and autonomous vehicles. Its low-power operation and configurable I/O make it a great choice for applications that require high-speed logic and low-power operation. Additionally, its advanced architecture allows it to be used in a variety of applications, making it a great choice for applications that require high performance and low power consumption.
The product description and design requirements of the chip model XC3SD1800A-5CS484C are available in the product datasheet. The datasheet outlines the features and performance of the chip model, as well as the design requirements for its use. Additionally, the datasheet includes a number of actual case studies and precautions that should be taken when using the chip model.
In conclusion, the chip model XC3SD1800A-5CS484C is a low-power, high-performance FPGA from Xilinx, Inc. It is designed for use in a variety of applications, including embedded systems, industrial control, automotive, and consumer electronics. The chip model has several advantages over similar products in the market, including its advanced architecture, low-power operation, and configurable I/O. The demand for the chip model is expected to increase in the near future due to its advanced features and performance. Additionally, it can be used in a variety of intelligent scenarios, including networks, smart homes, and autonomous vehicles. The product description and design requirements of the chip model are available in the product datasheet, which outlines the features and performance of the chip model, as well as the design requirements for its use.
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1,188 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $71.8211 | $71.8211 |
| 10+ | $71.0488 | $710.4884 |
| 100+ | $67.1875 | $6,718.7490 |
| 1000+ | $63.3261 | $31,663.0700 |
| 10000+ | $57.9203 | $57,920.2500 |
| The price is for reference only, please refer to the actual quotation! | ||