
AMD Xilinx
XC3S5000-5FG1156C
XC3S5000-5FG1156C ECAD Model
XC3S5000-5FG1156C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 784 | |
Number of Outputs | 784 | |
Number of Logic Cells | 74880 | |
Number of Equivalent Gates | 5000000 | |
Number of CLBs | 8320 | |
Combinatorial Delay of a CLB-Max | 530 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8320 CLBS, 5000000 GATES | |
Clock Frequency-Max | 725 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3S5000-5FG1156C Datasheet Download
XC3S5000-5FG1156C Overview
The XC3S5000-5FG1156C chip model is a high-performance field programmable gate array (FPGA) device from Xilinx Inc. It is designed to provide a flexible and cost-effective solution for a variety of applications. The chip model provides a wide range of features, including high-speed logic, embedded memory, high-speed transceivers, and on-chip power management.
The XC3S5000-5FG1156C chip model has many advantages over other FPGA devices. It is a low-cost, high-performance device that offers a wide range of features and can be used in a variety of applications. It is also designed to be scalable, meaning that the same device can be used in different applications and can be easily upgraded to meet the changing needs of the user.
The demand for the XC3S5000-5FG1156C chip model is expected to increase in the future, as it is a cost-effective solution for many applications. It is particularly well-suited for use in networks, as it can be used to create powerful and reliable connections between different devices and networks. It can also be used in the development of intelligent systems, as it can be programmed to recognize patterns and respond accordingly.
The XC3S5000-5FG1156C chip model is also suitable for use in the development of intelligent robots. It can be used to create robots that are capable of learning and responding to their environment. This is because the chip model is capable of being programmed to recognize patterns and respond accordingly. To use the chip model effectively, it is important to have a good understanding of the underlying technology and the programming language used to program the chip.
In conclusion, the XC3S5000-5FG1156C chip model is a cost-effective and high-performance device that can be used in a variety of applications. It is particularly well-suited for use in networks and the development of intelligent systems and robots. To use the model effectively, it is important to have a good understanding of the underlying technology and the programming language used to program the chip.
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2,034 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $126.4800 | $126.4800 |
10+ | $125.1200 | $1,251.2000 |
100+ | $118.3200 | $11,832.0000 |
1000+ | $111.5200 | $55,760.0000 |
10000+ | $102.0000 | $102,000.0000 |
The price is for reference only, please refer to the actual quotation! |