XC3S5000-5FG1156C
XC3S5000-5FG1156C
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AMD Xilinx

XC3S5000-5FG1156C


XC3S5000-5FG1156C
F20-XC3S5000-5FG1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC3S5000-5FG1156C ECAD Model


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XC3S5000-5FG1156C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 784
Number of Outputs 784
Number of Logic Cells 74880
Number of Equivalent Gates 5000000
Number of CLBs 8320
Combinatorial Delay of a CLB-Max 530 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8320 CLBS, 5000000 GATES
Clock Frequency-Max 725 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S5000-5FG1156C Datasheet Download


XC3S5000-5FG1156C Overview



The XC3S5000-5FG1156C chip model is a high-performance field programmable gate array (FPGA) device from Xilinx Inc. It is designed to provide a flexible and cost-effective solution for a variety of applications. The chip model provides a wide range of features, including high-speed logic, embedded memory, high-speed transceivers, and on-chip power management.


The XC3S5000-5FG1156C chip model has many advantages over other FPGA devices. It is a low-cost, high-performance device that offers a wide range of features and can be used in a variety of applications. It is also designed to be scalable, meaning that the same device can be used in different applications and can be easily upgraded to meet the changing needs of the user.


The demand for the XC3S5000-5FG1156C chip model is expected to increase in the future, as it is a cost-effective solution for many applications. It is particularly well-suited for use in networks, as it can be used to create powerful and reliable connections between different devices and networks. It can also be used in the development of intelligent systems, as it can be programmed to recognize patterns and respond accordingly.


The XC3S5000-5FG1156C chip model is also suitable for use in the development of intelligent robots. It can be used to create robots that are capable of learning and responding to their environment. This is because the chip model is capable of being programmed to recognize patterns and respond accordingly. To use the chip model effectively, it is important to have a good understanding of the underlying technology and the programming language used to program the chip.


In conclusion, the XC3S5000-5FG1156C chip model is a cost-effective and high-performance device that can be used in a variety of applications. It is particularly well-suited for use in networks and the development of intelligent systems and robots. To use the model effectively, it is important to have a good understanding of the underlying technology and the programming language used to program the chip.



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Unit Price: $136.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $126.4800 $126.4800
10+ $125.1200 $1,251.2000
100+ $118.3200 $11,832.0000
1000+ $111.5200 $55,760.0000
10000+ $102.0000 $102,000.0000
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