
AMD Xilinx
XC3S50-5TQ144C
XC3S50-5TQ144C ECAD Model
XC3S50-5TQ144C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 97 | |
Number of Outputs | 97 | |
Number of Logic Cells | 1728 | |
Number of Equivalent Gates | 50000 | |
Number of CLBs | 192 | |
Combinatorial Delay of a CLB-Max | 530 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 192 CLBS, 50000 GATES | |
Clock Frequency-Max | 725 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e4 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | 22 X 22 MM, TQFP-144 | |
Pin Count | 144 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC3S50-5TQ144C Datasheet Download
XC3S50-5TQ144C Overview
The Xilinx XC3S50-5TQ144C is a Field Programmable Gate Array (FPGA) chip designed to provide a flexible and cost-effective solution for a variety of applications. It is a low-cost, low-power, high-performance FPGA device that is ideal for a wide range of applications including digital signal processing, data acquisition, communications, and embedded systems.
The XC3S50-5TQ144C chip is designed to provide a high level of flexibility and scalability, allowing for easy upgrades and modifications. It is capable of supporting up to 144K logic cells, providing the ability to implement complex designs with ease. Additionally, the XC3S50-5TQ144C chip offers a wide range of I/O options, including LVDS, SSTL, and HSTL, as well as a variety of memory interfaces.
The XC3S50-5TQ144C chip is well-suited for a variety of applications and can be used in advanced communication systems. It is capable of supporting a variety of communication protocols and can be used in a wide range of networks, from simple point-to-point connections to complex mesh networks. Additionally, the XC3S50-5TQ144C chip is capable of supporting a variety of intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML).
In terms of product design and specific requirements, the XC3S50-5TQ144C chip is designed to meet the most stringent requirements. It is designed to operate at a maximum temperature of 85°C and is designed to meet the requirements of the JEDEC and AEC-Q100 specifications. Additionally, the XC3S50-5TQ144C chip is designed to be compatible with a variety of operating systems and development tools.
To demonstrate the capabilities of the XC3S50-5TQ144C chip, a number of case studies have been conducted. For example, the chip was used in a project to develop an intelligent network for a large-scale industrial automation system. The project was successful, demonstrating the capabilities of the XC3S50-5TQ144C chip in a large-scale industrial environment.
When using the XC3S50-5TQ144C chip, it is important to keep in mind a few precautions. It is important to ensure that the chip is not exposed to any extreme temperatures or humidity levels, as this could cause damage to the chip. Additionally, it is important to ensure that the chip is not exposed to any static electricity, as this could also cause damage to the chip.
The Xilinx XC3S50-5TQ144C is a powerful and flexible FPGA chip that is well-suited for a variety of applications. It is capable of supporting up to 144K logic cells, providing the ability to implement complex designs with ease. Additionally, the XC3S50-5TQ144C chip offers a wide range of I/O options, making it suitable for a variety of communication protocols. It is also capable of supporting a variety of intelligent scenarios, making it suitable for the era of fully intelligent systems. With its high level of flexibility and scalability, the XC3S50-5TQ144C chip is an ideal solution for a variety of applications.
2,224 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $12.9679 | $12.9679 |
10+ | $12.8285 | $128.2848 |
100+ | $12.1313 | $1,213.1280 |
1000+ | $11.4341 | $5,717.0400 |
10000+ | $10.4580 | $10,458.0000 |
The price is for reference only, please refer to the actual quotation! |