AMD Xilinx
XC3S200-5TQ144C
XC3S200-5TQ144C ECAD Model
XC3S200-5TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 97 | |
| Number of Outputs | 97 | |
| Number of Logic Cells | 4320 | |
| Number of Equivalent Gates | 200000 | |
| Number of CLBs | 480 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 480 CLBS, 200000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 22 X 22 MM, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S200-5TQ144C Datasheet Download
XC3S200-5TQ144C Overview
The XC3S200-5TQ144C chip model is a powerful and reliable device that offers a range of advantages for its users. This model is designed to provide high-performance, low-power, and low-cost solutions for various applications. It is also a highly flexible device that can be used in a wide variety of applications, including communication systems and intelligent robots.
The XC3S200-5TQ144C chip model is a field programmable gate array (FPGA) device that offers a wide range of features and benefits. It is a low-cost, low-power, and high-performance device that has been designed to meet the needs of various applications. It has a large number of configurable logic blocks, memory blocks, and digital signal processing (DSP) blocks, which make it a highly versatile device. It also offers a wide range of I/O interfaces, making it suitable for use in a variety of applications.
The XC3S200-5TQ144C chip model is expected to be in high demand in the future due to its versatile features and benefits. This model is designed to be a reliable and cost-effective solution for various applications and is expected to be used in a wide variety of applications, such as communication systems, intelligent robots, and other applications.
The original design intention of the XC3S200-5TQ144C chip model was to provide a highly reliable and cost-effective solution for various applications. It is designed to provide a wide range of features and benefits, including a large number of configurable logic blocks, memory blocks, and digital signal processing (DSP) blocks. It is also designed to be highly flexible, offering a wide range of I/O interfaces, making it suitable for use in a wide variety of applications.
The XC3S200-5TQ144C chip model is also designed to be upgradeable, allowing users to customize the device for their specific needs. The device is designed to be compatible with various software and hardware components, making it suitable for use in various applications. It is also designed to be highly reliable and to provide a low-cost solution for various applications.
The XC3S200-5TQ144C chip model can also be applied to the development and popularization of future intelligent robots. This model is designed to provide a wide range of features and benefits, including a large number of configurable logic blocks, memory blocks, and digital signal processing (DSP) blocks. It is also designed to be highly flexible, offering a wide range of I/O interfaces, making it suitable for use in a wide variety of applications.
In order to use the XC3S200-5TQ144C chip model effectively, technical talents such as engineers, computer scientists, and roboticists are needed. These professionals will be able to design, develop, and implement the device for various applications. They will also be able to customize the device for specific applications and use it for the development and popularization of future intelligent robots.
2,851 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17.5586 | $17.5586 |
| 10+ | $17.3698 | $173.6978 |
| 100+ | $16.4258 | $1,642.5774 |
| 1000+ | $15.4818 | $7,740.8820 |
| 10000+ | $14.1602 | $14,160.1500 |
| The price is for reference only, please refer to the actual quotation! | ||