AMD Xilinx
XC3S50-5PQ208C
XC3S50-5PQ208C ECAD Model
XC3S50-5PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 124 | |
| Number of Outputs | 124 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 192 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 192 CLBS, 50000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 30.60 X 30.60 MM, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S50-5PQ208C Datasheet Download
XC3S50-5PQ208C Overview
The XC3S50-5PQ208C chip model is a powerful, versatile and reliable integrated circuit that has been designed to meet the needs of today’s modern communications systems. This chip model is a low-cost, low-power solution with an impressive range of features and capabilities. It offers a wide range of features such as high-speed data transfer, low power consumption, high-speed communication and low latency.
The XC3S50-5PQ208C chip model is designed to be compatible with a variety of communication systems, including the latest 5G networks. It is also capable of supporting a range of advanced technologies, such as advanced signal processing and encoding algorithms. This chip model is also designed to be highly reliable, with a low failure rate and long-term reliability.
The original design intention of the XC3S50-5PQ208C chip model was to provide a low-cost, low-power solution that could be used in a wide range of applications. The chip model is designed to be highly reliable, with a low failure rate and long-term reliability. It is also designed to be compatible with a variety of communication systems, including the latest 5G networks.
In terms of industry trends, the XC3S50-5PQ208C chip model is expected to remain a popular choice for a variety of communication systems. It is also expected to be used in a range of advanced communication systems, such as 5G networks. The chip model is also expected to remain a popular choice for applications that require high-speed data transfer, low power consumption, high-speed communication and low latency.
In terms of future development, the XC3S50-5PQ208C chip model is expected to remain a popular choice for a variety of communication systems. It is also expected to be used in a range of advanced communication systems, such as 5G networks. The chip model is also expected to remain a popular choice for applications that require high-speed data transfer, low power consumption, high-speed communication and low latency.
The product description of the XC3S50-5PQ208C chip model includes features such as high-speed data transfer, low power consumption, high-speed communication and low latency. It also includes features such as advanced signal processing and encoding algorithms, as well as compatibility with a variety of communication systems, including the latest 5G networks.
When it comes to actual case studies and precautions, it is important to consider the environmental conditions in which the XC3S50-5PQ208C chip model will be used. It is also important to consider the specific technologies that are needed for the application environment, as well as the potential for future upgrades. In addition, it is also important to consider the cost of the chip model and the potential impact that it may have on the overall budget of the project.
In conclusion, the XC3S50-5PQ208C chip model is a powerful, versatile and reliable integrated circuit that has been designed to meet the needs of today’s modern communications systems. It is designed to be highly reliable, with a low failure rate and long-term reliability. It is also designed to be compatible with a variety of communication systems, including the latest 5G networks. In terms of industry trends, the XC3S50-5PQ208C chip model is expected to remain a popular choice for a variety of communication systems. It is also important to consider the environmental conditions in which the XC3S50-5PQ208C chip model will be used, as well as the specific technologies that are needed for the application environment, and the potential for future upgrades.
You May Also Be Interested In
1,230 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $16.1821 | $16.1821 |
| 10+ | $16.0081 | $160.0809 |
| 100+ | $15.1381 | $1,513.8087 |
| 1000+ | $14.2681 | $7,134.0410 |
| 10000+ | $13.0501 | $13,050.0750 |
| The price is for reference only, please refer to the actual quotation! | ||