AMD Xilinx
XC3S200-5PQ208C
XC3S200-5PQ208C ECAD Model
XC3S200-5PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 141 | |
| Number of Outputs | 141 | |
| Number of Logic Cells | 4320 | |
| Number of Equivalent Gates | 200000 | |
| Number of CLBs | 480 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 480 CLBS, 200000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 30.60 X 30.60 MM, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S200-5PQ208C Datasheet Download
XC3S200-5PQ208C Overview
The XC3S200-5PQ208C chip model is an innovative piece of technology that is designed to provide a wide range of benefits for businesses and users in the current and future digital age. This chip model is designed to meet the needs of both industrial and consumer applications. Its features and design make it an ideal choice for a range of applications, including networking, intelligent systems, and more.
The XC3S200-5PQ208C chip model provides a number of advantages that make it a desirable choice for many industries. It is a highly efficient chip that is designed to be able to process complex tasks quickly and accurately. This chip is also designed to be extremely reliable, offering a long-term solution for users. Additionally, the chip is designed to be energy-efficient, reducing power consumption and helping to reduce costs.
The demand for the XC3S200-5PQ208C chip model is expected to grow in the coming years. This is due to its ability to provide users with a wide range of benefits, including improved performance, reliability, and energy efficiency. Additionally, the chip is designed to be compatible with a range of different applications, making it a desirable choice for many industries. As the demand for more advanced technology grows, the XC3S200-5PQ208C chip model is likely to become even more popular.
The XC3S200-5PQ208C chip model can be used in a variety of applications, including networks and intelligent systems. It is designed to be able to process large amounts of data quickly and accurately, making it an ideal choice for intelligent systems. Additionally, the chip is designed to be compatible with a range of different networks, making it a suitable choice for networking applications. In the future, the chip model is likely to be used in a wide range of intelligent scenarios, including autonomous vehicles and smart homes.
The design of the XC3S200-5PQ208C chip model is specifically tailored to meet the needs of users. It is designed to be able to process complex tasks quickly and accurately, while also being energy-efficient. Additionally, the chip is designed to be reliable and durable, providing users with a long-term solution. To ensure optimal performance, the chip model is designed to be compatible with a range of different applications and networks.
In order to ensure the best possible performance of the XC3S200-5PQ208C chip model, it is important to adhere to certain design requirements. For example, the chip should be properly cooled to ensure optimal performance. Additionally, the chip should be placed in an environment that is free from dust and other contaminants. Additionally, the chip should be tested regularly to ensure that it is functioning properly.
The XC3S200-5PQ208C chip model has been used in a variety of case studies to demonstrate its effectiveness. For example, the chip model has been used in a number of autonomous vehicles to provide reliable and accurate performance. Additionally, the chip has been used in a number of networking applications to provide users with a reliable and efficient solution. These case studies demonstrate the effectiveness of the chip model and its ability to provide users with a reliable and efficient solution.
The XC3S200-5PQ208C chip model is an innovative piece of technology that is designed to provide users with a wide range of benefits. Its features and design make it an ideal choice for a range of applications, including networking, intelligent systems, and more. With its ability to provide users with improved performance, reliability, and energy efficiency, the chip model is expected to become even more popular in the future. In order to ensure the best possible performance, it is important to adhere to certain design requirements and to test the chip regularly. With its wide range of applications and its ability to provide users with a reliable and efficient solution, the XC3S200-5PQ208C chip model is an ideal choice for many industries.
You May Also Be Interested In
2,784 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.5476 | $23.5476 |
| 10+ | $23.2944 | $232.9440 |
| 100+ | $22.0284 | $2,202.8400 |
| 1000+ | $20.7624 | $10,381.2000 |
| 10000+ | $18.9900 | $18,990.0000 |
| The price is for reference only, please refer to the actual quotation! | ||