AMD Xilinx
XC3S50-5CP132C
XC3S50-5CP132C ECAD Model
XC3S50-5CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 89 | |
| Number of Outputs | 89 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 192 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 192 CLBS, 50000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 8 X 8 MM, CSP-132 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 132 |
XC3S50-5CP132C Datasheet Download
XC3S50-5CP132C Overview
The chip model XC3S50-5CP132C is the latest addition to the Xilinx Spartan-3 family of Field Programmable Gate Arrays (FPGAs). This model is designed to provide users with a cost-effective solution for their specific needs. It features a wide range of features and benefits, such as a low power consumption, a small form factor, and a high-speed interface.
The XC3S50-5CP132C is designed to meet the demands of a wide range of applications, from simple consumer electronics to complex industrial systems. It is suitable for a variety of applications, including embedded systems, digital signal processing, control systems, and communication systems. The chip model is also suitable for use in high-speed data processing, image processing, and other advanced applications.
The original design intent of the XC3S50-5CP132C was to provide users with a cost-effective solution for their specific needs. It is designed to provide users with a low-power, high-speed, and reliable solution. The chip model is also designed to be highly customizable, allowing users to tailor the chip model to their specific needs.
The XC3S50-5CP132C is expected to be in high demand in the future, as it is suitable for a wide range of applications. It is expected to be widely used in the consumer electronics industry, as well as in industrial and commercial applications. The chip model is also expected to be used in advanced communication systems, such as 5G, Wi-Fi, and other high-speed networks.
The XC3S50-5CP132C is designed to be highly upgradable, and it is possible for users to upgrade the chip model to meet their specific needs. The chip model is also designed to be compatible with new technologies, and it is possible for users to upgrade the chip model to support new technologies.
In conclusion, the XC3S50-5CP132C is a cost-effective solution for a wide range of applications. It is designed to provide users with a low-power, high-speed, and reliable solution. The chip model is also designed to be highly customizable and upgradable, allowing users to tailor the chip model to their specific needs. It is expected to be widely used in the consumer electronics industry, as well as in industrial and commercial applications. It is also expected to be used in advanced communication systems, such as 5G, Wi-Fi, and other high-speed networks. The chip model is also designed to be compatible with new technologies, and it is possible for users to upgrade the chip model to support new technologies.
2,676 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9.0469 | $9.0469 |
| 10+ | $8.9497 | $89.4967 |
| 100+ | $8.4633 | $846.3273 |
| 1000+ | $7.9769 | $3,988.4390 |
| 10000+ | $7.2959 | $7,295.9250 |
| The price is for reference only, please refer to the actual quotation! | ||