AMD Xilinx
XC3S50-4CP132C
XC3S50-4CP132C ECAD Model
XC3S50-4CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 89 | |
| Number of Outputs | 89 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 192 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 192 CLBS, 50000 GATES | |
| Clock Frequency-Max | 630 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 8 X 8 MM, CSP-132 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 132 |
XC3S50-4CP132C Datasheet Download
XC3S50-4CP132C Overview
The XC3S50-4CP132C is a Field Programmable Gate Array (FPGA) chip model from Xilinx Corporation. It is designed to be a highly flexible and powerful chip model for a variety of applications. It is capable of carrying out a variety of tasks, ranging from basic logic functions to complex real-time processing.
The XC3S50-4CP132C has a number of advantages over traditional chip models. It is a low-cost solution that can be quickly customized to meet specific requirements. In addition, it is capable of being used in a wide range of applications, from basic logic functions to the most complex real-time processing tasks. Furthermore, it is highly reliable and has a long service life.
The XC3S50-4CP132C is expected to be in high demand in the near future, as it is applicable to many industries. It is especially useful for networking applications, as it can be used to create high-speed, reliable networks. Additionally, it is a suitable choice for intelligent systems, as it can be used to implement complex algorithms and processes. Furthermore, its flexibility and low cost make it an ideal choice for the era of fully intelligent systems.
The XC3S50-4CP132C has a number of design requirements that must be met in order for it to be used effectively. Firstly, it requires a specific power supply and a clock frequency that is within a certain range. Secondly, it must be connected to a suitable memory device. Thirdly, it must be connected to an appropriate interface, such as a USB port or Ethernet port. Finally, it must be programmed correctly in order to ensure that it is functioning correctly.
In order to illustrate the effectiveness of the XC3S50-4CP132C, there are several case studies that have been conducted. One example is the use of the chip model in the development of a wireless sensor network. This network was able to detect and monitor environmental conditions, such as temperature and humidity. Another example is the use of the chip model in the development of a smart home system. This system was able to detect and respond to a variety of events, such as the opening of a door or window.
When using the XC3S50-4CP132C, it is important to take certain precautions. Firstly, it is important to ensure that the power supply and clock frequency are within the specified range. Secondly, it is important to ensure that the memory device is compatible with the chip model. Thirdly, it is important to ensure that the correct programming is used in order to ensure that the chip model is functioning correctly. Finally, it is important to ensure that the chip model is connected to the appropriate interface.
In conclusion, the XC3S50-4CP132C is a highly versatile and powerful chip model that is applicable to a variety of industries. It is expected to be in high demand in the near future, as it is suitable for networking applications and intelligent systems. It has a number of design requirements that must be met in order for it to be used effectively, and there are several case studies that have been conducted to illustrate its effectiveness. When using the XC3S50-4CP132C, it is important to take certain precautions in order to ensure that it is functioning correctly.
3,668 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.5621 | $6.5621 |
| 10+ | $6.4915 | $64.9152 |
| 100+ | $6.1387 | $613.8720 |
| 1000+ | $5.7859 | $2,892.9600 |
| 10000+ | $5.2920 | $5,292.0000 |
| The price is for reference only, please refer to the actual quotation! | ||