XC3S4000-5FG1156C
XC3S4000-5FG1156C
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AMD Xilinx

XC3S4000-5FG1156C


XC3S4000-5FG1156C
F20-XC3S4000-5FG1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC3S4000-5FG1156C ECAD Model


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XC3S4000-5FG1156C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 712
Number of Outputs 712
Number of Logic Cells 62208
Number of Equivalent Gates 4000000
Number of CLBs 6912
Combinatorial Delay of a CLB-Max 530 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 6912 CLBS, 4000000 GATES
Clock Frequency-Max 725 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S4000-5FG1156C Datasheet Download


XC3S4000-5FG1156C Overview



The chip model XC3S4000-5FG1156C is a revolutionary product in the field of chip technology. It is a high-end chip developed by Xilinx, a leading provider of programmable logic solutions. This chip is equipped with a high-performance, low-power FPGA, which has a wide range of applications in the communication field.


The chip model XC3S4000-5FG1156C is designed with a number of advanced features to meet the needs of the most demanding applications. It is equipped with a high-speed, low-power, low-noise FPGA, which can be used for a variety of communication and network applications. The chip also has a high performance, low-power, low-noise memory controller, which can be used for data processing, storage, and transmission.


In terms of industry trends, the chip model XC3S4000-5FG1156C is designed to support the latest communication technologies. It is capable of supporting the latest 5G, Wi-Fi 6, and Bluetooth 5.0 standards. It is also capable of supporting the latest AI-enabled applications and networks, such as facial recognition, voice recognition, and autonomous driving.


The chip model XC3S4000-5FG1156C is also designed to be easily upgradable in the future. It is designed to support the latest technologies and protocols, such as the Internet of Things (IoT) and the upcoming 5G networks. This chip can be used in advanced communication systems, such as the 5G networks, and can be used for a variety of applications.


In terms of future applications, the chip model XC3S4000-5FG1156C can be used in a variety of intelligent scenarios. It can be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and the upcoming 5G networks. It can also be used in the field of autonomous driving and other advanced applications.


Overall, the chip model XC3S4000-5FG1156C is a revolutionary product in the field of chip technology. It is designed with advanced features to meet the needs of the most demanding applications. It is capable of supporting the latest communication technologies, and is capable of being easily upgradable in the future. It can be used in a variety of intelligent scenarios, such as the Internet of Things (IoT) and the upcoming 5G networks. This chip is the perfect choice for those who want to take advantage of the latest technology.



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Unit Price: $216.0756
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Pricing (USD)

QTY Unit Price Ext Price
1+ $200.9503 $200.9503
10+ $198.7896 $1,987.8955
100+ $187.9858 $18,798.5772
1000+ $177.1820 $88,590.9960
10000+ $162.0567 $162,056.7000
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