
AMD Xilinx
XC3190L-3TQ176C
XC3190L-3TQ176C ECAD Model
XC3190L-3TQ176C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 144 | |
Number of Outputs | 144 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 2.7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | TYP. GATES = 5000-6000 | |
Clock Frequency-Max | 270 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G176 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 176 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP176,1.0SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 24 mm | |
Length | 24 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | LFQFP, QFP176,1.0SQ,20 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | QFP | |
Pin Count | 176 |
XC3190L-3TQ176C Datasheet Download
XC3190L-3TQ176C Overview
XC3190L-3TQ176C is a highly advanced chip model designed to meet the needs of a wide range of industries. It is a low-power, high-performance, and cost-effective solution to the ever-growing demands of communication systems. It is a product of the Xilinx Corporation, an industry leader in the field of programmable logic devices.
XC3190L-3TQ176C is designed with an array of features that make it an ideal choice for a variety of applications. It has a low power consumption, allowing for efficient operation and energy savings. It also features a wide range of I/O capabilities, making it suitable for a range of communication systems. The chip model also has a high-speed operation, allowing for quick and reliable data transmission. Additionally, the chip model is equipped with a range of advanced features such as programmable logic, clock frequency control, and integrated memory blocks.
The XC3190L-3TQ176C chip model is expected to become increasingly popular in the coming years due to its cost-effectiveness and reliability. The chip model is also designed with future upgrades in mind, making it a great choice for those looking to stay ahead of the curve. It is also suitable for use in advanced communication systems, making it an ideal choice for those looking to stay ahead of the competition.
When it comes to product description and design requirements, XC3190L-3TQ176C is designed to meet the needs of a wide range of industries. It is a low-power, high-performance, and cost-effective solution to the ever-growing demands of communication systems. It is equipped with a range of features such as programmable logic, clock frequency control, and integrated memory blocks. Additionally, the chip model is designed with an array of I/O capabilities, making it suitable for a range of communication systems.
In order to ensure the best results, there are a few precautions that must be taken when using the chip model. It is important to ensure that the chip model is installed correctly, as incorrect installation can lead to a variety of issues. Additionally, it is important to ensure that the chip model is properly maintained in order to ensure optimal performance. Lastly, it is important to read the product documentation thoroughly in order to ensure that the chip model is used correctly.
To conclude, XC3190L-3TQ176C is a highly advanced chip model designed to meet the needs of a wide range of industries. It is a low-power, high-performance, and cost-effective solution to the ever-growing demands of communication systems. It is expected to become increasingly popular in the coming years due to its cost-effectiveness and reliability. Additionally, it is designed with future upgrades in mind, making it a great choice for those looking to stay ahead of the curve. Lastly, it is important to read the product documentation thoroughly in order to ensure that the chip model is used correctly.
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3,260 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $206.4600 | $206.4600 |
10+ | $204.2400 | $2,042.4000 |
100+ | $193.1400 | $19,314.0000 |
1000+ | $182.0400 | $91,020.0000 |
10000+ | $166.5000 | $166,500.0000 |
The price is for reference only, please refer to the actual quotation! |