AMD Xilinx
XC3190L-2TQ176C
XC3190L-2TQ176C ECAD Model
XC3190L-2TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | TYP. GATES = 5000-6000 | |
| Clock Frequency-Max | 325 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP176,1.0SQ,20 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190L-2TQ176C Datasheet Download
XC3190L-2TQ176C Overview
The XC3190L-2TQ176C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be compatible with HDLL (Hardware Description Language) for ease of use and development. This chip model is highly efficient and can be used in a wide variety of applications.
The industry trends and future development of the XC3190L-2TQ176C chip model and related industries are highly dependent on the specific technologies needed for the application environment. The chip model was originally designed with the intention of providing a powerful and efficient tool for digital signal processing, embedded processing, and image processing. It is possible to upgrade the chip model in the future to support more advanced communication systems.
The XC3190L-2TQ176C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed with the intention of providing a powerful and efficient tool that can be used in a wide range of applications. It is compatible with HDLL (Hardware Description Language) for ease of use and development. The chip model is highly efficient and can be used in a wide variety of applications.
The industry trends and future development of the XC3190L-2TQ176C chip model and related industries are highly dependent on the specific technologies needed for the application environment. As technology advances, the chip model may need to be upgraded to support more advanced communication systems. This chip model is highly efficient and can be used in a wide variety of applications.
In conclusion, the XC3190L-2TQ176C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be compatible with HDLL for ease of use and development. The chip model is highly efficient and can be used in a wide variety of applications. The industry trends and future development of the chip model and related industries are highly dependent on the specific technologies needed for the application environment. It is possible to upgrade the chip model in the future to support more advanced communication systems.
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|---|---|---|
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