AMD Xilinx
XC3190A-3TQ176C
XC3190A-3TQ176C ECAD Model
XC3190A-3TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LFQFP, QFP176,1.0SQ,20 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 176 |
XC3190A-3TQ176C Datasheet Download
XC3190A-3TQ176C Overview
The XC3190A-3TQ176C chip model is a cutting-edge development in the semiconductor industry, and its capabilities are far-reaching. As one of the most advanced models on the market, XC3190A-3TQ176C has the potential to revolutionize the way we interact with technology.
The XC3190A-3TQ176C chip model is equipped with an array of features that make it an ideal choice for a variety of applications. It has a wide range of applications, from automotive to industrial and consumer electronics. It is also a great choice for mobile devices due to its low power consumption and high performance. Its high-speed operation and low power consumption also make it an ideal choice for IoT applications.
In terms of industry trends, the XC3190A-3TQ176C chip model is expected to be in high demand in the future. As technology continues to advance, the demand for high-performance chips will only increase. The XC3190A-3TQ176C chip model is well-suited to meet this demand, as it is capable of handling complex tasks with ease.
The XC3190A-3TQ176C chip model is also well-suited for use in the development of intelligent robots. Its high-speed operation and low power consumption make it an ideal choice for robotic applications. Furthermore, its flexibility allows it to be used in a wide range of robotic applications. To use the XC3190A-3TQ176C chip model effectively, technical knowledge and expertise in robotics and artificial intelligence is required.
In conclusion, the XC3190A-3TQ176C chip model is an ideal choice for a wide range of applications. Its high-speed operation and low power consumption make it an ideal choice for a variety of applications, from automotive to industrial and consumer electronics. It is also well-suited for use in the development of intelligent robots, but requires technical knowledge and expertise in robotics and artificial intelligence. As technology continues to advance, the demand for high-performance chips is only expected to increase, making the XC3190A-3TQ176C chip model a great choice for the future.
You May Also Be Interested In
1,964 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||