AMD Xilinx
XC3190A-2TQ176C
XC3190A-2TQ176C ECAD Model
XC3190A-2TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP176,1.0SQ,20 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-2TQ176C Datasheet Download
XC3190A-2TQ176C Overview
The XC3190A-2TQ176C chip model is a powerful and versatile integrated circuit that is suitable for a variety of high-performance applications, such as digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, making it a great choice for those looking to develop complex, high-performance systems.
The chip model is well-suited to a variety of industries, including automotive, aerospace, medical, and consumer electronics. In the automotive industry, for example, the chip model can be used to create advanced driver assistance systems (ADAS) and autonomous vehicle systems. In the aerospace industry, the chip model can be used to create sophisticated navigation and control systems for aircraft, as well as for space exploration.
In terms of future development, the chip model is likely to remain a popular choice for those looking to develop high-performance systems. As technology advances, the chip model will likely be adapted to support new technologies, such as artificial intelligence (AI), machine learning (ML), and 5G communication.
The XC3190A-2TQ176C chip model can also be applied to the development and popularization of future intelligent robots. The chip model can be used to create sophisticated robotic systems that are capable of performing complex tasks, such as navigation, object recognition, and decision-making. To effectively use the chip model, engineers and developers will need to have a deep understanding of HDL language, as well as a strong background in robotics and AI.
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