AMD Xilinx
XC3090L-8TQ176I
XC3090L-8TQ176I ECAD Model
XC3090L-8TQ176I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 6.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 80 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP176,1.0SQ,20 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090L-8TQ176I Datasheet Download
XC3090L-8TQ176I Overview
The XC3090L-8TQ176I chip model is a powerful and versatile model that is rapidly gaining popularity in the chip industry. This model is suitable for a wide range of applications, including embedded systems, industrial automation, and consumer electronics. It is one of the most advanced chip models available, offering superior performance and reliability.
The XC3090L-8TQ176I chip model is designed with the latest technology, allowing it to support a variety of applications. It is highly efficient and can handle a wide range of tasks, including digital signal processing, image processing, and data storage. Furthermore, the model has an advanced power management system that can help conserve energy.
In terms of industry trends, the XC3090L-8TQ176I chip model is expected to be increasingly in demand in the future. This is due to its high performance, as well as its ability to support a variety of applications. Additionally, its low power consumption makes it an attractive option for many industries. As a result, it is likely that the demand for this model will continue to grow in the future.
As for whether the XC3090L-8TQ176I chip model can be applied to the development and popularization of future intelligent robots, it is certainly possible. This model is well-suited for robotics applications, as it is capable of handling complex tasks and has a high level of power efficiency. Furthermore, the model can be used to create robots that are capable of performing a variety of tasks, such as navigation and object recognition.
In order to use the XC3090L-8TQ176I chip model effectively, certain technical talents are needed. This includes knowledge of computer programming, as well as knowledge of robotics and artificial intelligence. Additionally, knowledge of the specific applications and tasks that the model will be used for is also essential. With the right knowledge and skills, the XC3090L-8TQ176I chip model can be used to create powerful and advanced robots that are capable of performing a variety of tasks.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||