AMD Xilinx
XC3090-70PG175I
XC3090-70PG175I ECAD Model
XC3090-70PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-70PG175I Datasheet Download
XC3090-70PG175I Overview
The Xilinx XC3090-70PG175I chip is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, and image processing. It is also capable of running HDL (Hardware Description Language) code, making it a great choice for engineers and developers looking to build complex systems.
The XC3090-70PG175I offers a number of advantages that make it a great choice for many applications. It has a high clock speed, allowing for fast data processing, and its architecture is optimized for memory and logic operations. In addition, it is designed to be highly reliable and has a long lifespan.
The XC3090-70PG175I is expected to be in high demand in the future, particularly in the fields of robotics and artificial intelligence. As AI and robotics continue to become more advanced, the need for powerful, reliable chips that can handle complex operations will only increase. The XC3090-70PG175I is well-suited to meet this demand, providing a powerful and reliable platform that can handle various kinds of tasks.
The XC3090-70PG175I can also be used in the development and popularization of future intelligent robots. Its powerful architecture and ability to run HDL code make it a great choice for creating complex systems that can handle a wide range of tasks. To use the XC3090-70PG175I effectively, developers need to have a good understanding of HDL, as well as experience in hardware design and programming.
In conclusion, the Xilinx XC3090-70PG175I is a powerful and versatile chip that is well-suited for high-performance digital signal processing, embedded processing, and image processing. It is also a great choice for developers looking to build complex systems for use in robotics and AI. To use the XC3090-70PG175I effectively, developers need to have a good understanding of HDL and experience in hardware design and programming.
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