AMD Xilinx
XC3090-70PG175C
XC3090-70PG175C ECAD Model
XC3090-70PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-70PG175C Datasheet Download
XC3090-70PG175C Overview
The XC3090-70PG175C chip model is a powerful and reliable semiconductor device that has been gaining a lot of attention in the electronics industry. It is a high-performance, low-power chip model that is ideal for applications such as digital signal processing, wireless communication, and embedded computing. The XC3090-70PG175C is designed to provide high-speed data transmission and reliable operation in a wide range of network applications.
The XC3090-70PG175C chip model offers several advantages over other chip models. It is capable of operating at high speeds, with a maximum frequency of up to 1.2GHz. It is also designed to be highly efficient, with a power consumption of only 0.7W. This makes it ideal for applications that require low power consumption and high performance. Additionally, the XC3090-70PG175C has a wide range of features that make it suitable for a variety of applications, including high-speed data transmission, wireless communication, and embedded computing.
The demand for the XC3090-70PG175C chip model is expected to continue to grow in the future, as it is well suited for the development of intelligent systems and networks. This chip model is capable of providing high-speed data transmission and reliable operation in a variety of network applications. It is also suitable for the development of intelligent robots, as it is capable of providing high-speed data transmission, low power consumption, and reliable operation.
The XC3090-70PG175C chip model can also be used in the development of intelligent systems and networks for the future. It is capable of providing high-speed data transmission and reliable operation in a wide range of applications, including wireless communication, digital signal processing, and embedded computing. Additionally, the XC3090-70PG175C chip model can be used in the development of intelligent robots and other intelligent scenarios.
In order to use the XC3090-70PG175C chip model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed. These professionals will be able to utilize the chip model’s features and capabilities in order to develop and implement intelligent systems and networks. Additionally, they will be able to create and implement intelligent robots and other intelligent scenarios.
The XC3090-70PG175C chip model is an extremely powerful and reliable semiconductor device that is well suited for a variety of applications. It is capable of providing high-speed data transmission and reliable operation in a wide range of network applications. Additionally, it is suitable for the development of intelligent systems and networks for the future, as well as for the development of intelligent robots and other intelligent scenarios. Technical talents such as software engineers, hardware engineers, and system architects are needed to use the XC3090-70PG175C chip model effectively. The demand for this chip model is expected to continue to grow in the future, as it is an ideal choice for the development of intelligent systems and networks.
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2,775 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $81.2448 | $81.2448 |
| 10+ | $80.3712 | $803.7120 |
| 100+ | $76.0032 | $7,600.3200 |
| 1000+ | $71.6352 | $35,817.6000 |
| 10000+ | $65.5200 | $65,520.0000 |
| The price is for reference only, please refer to the actual quotation! | ||