AMD Xilinx
XC3090-50PG175M
XC3090-50PG175M ECAD Model
XC3090-50PG175M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XC3090-50PG175M Datasheet Download
XC3090-50PG175M Overview
The XC3090-50PG175M chip model is a powerful and versatile model that has been designed with a wide range of applications in mind. It is a high-performance, low-power, low-cost chip model that is suitable for a variety of applications, including communication systems, networks, and robotics.
The original design intention of the XC3090-50PG175M chip model was to provide an efficient and cost-effective solution for a variety of applications. It is capable of handling a wide range of tasks, from basic communication and networking tasks to more advanced applications such as machine learning and artificial intelligence. It is also capable of being used in the era of fully intelligent systems.
The XC3090-50PG175M chip model can be used in a variety of applications, including communication systems, networks, and robotics. It is capable of handling a wide range of tasks, from basic communication and networking tasks to more advanced applications such as machine learning and artificial intelligence. It is also capable of being used in the era of fully intelligent systems. The chip model is also upgradable, allowing users to easily upgrade the model to keep up with the latest technologies.
The XC3090-50PG175M chip model can also be used in the development and popularization of future intelligent robots. The model is capable of handling a wide range of tasks, from basic communication and networking tasks to more advanced applications such as machine learning and artificial intelligence. In order to use the model effectively, users will need to have a good understanding of the technology and a wide range of technical skills, including programming, electronics, and robotics.
In conclusion, the XC3090-50PG175M chip model is a powerful and versatile model that has been designed with a wide range of applications in mind. It is capable of handling a wide range of tasks, from basic communication and networking tasks to more advanced applications such as machine learning and artificial intelligence. It is also upgradable and can be used in the development and popularization of future intelligent robots. In order to use the model effectively, users will need to have a good understanding of the technology and a wide range of technical skills, including programming, electronics, and robotics.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||