AMD Xilinx
XC3090-50PG175I
XC3090-50PG175I ECAD Model
XC3090-50PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 9000 | |
| Number of CLBs | 320 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 9000 GATES | |
| Additional Feature | MAX 144 I/OS; 928 FLIP-FLOPS | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.5052 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-50PG175I Datasheet Download
XC3090-50PG175I Overview
The chip model XC3090-50PG175I is a high-performance integrated circuit (IC) that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It requires the use of HDL language, which is a hardware description language that is used to describe the behavior of digital systems.
The chip model XC3090-50PG175I has several advantages that make it an attractive choice for many industries. It is designed to be highly reliable and efficient, making it a great choice for applications that require a high degree of accuracy and performance. Additionally, the chip model is designed to be power-efficient, meaning it will not consume a large amount of energy while in use. Finally, it is also designed to be cost-effective, making it a great choice for companies looking to reduce their costs.
The chip model XC3090-50PG175I is expected to be in high demand in the future, as more industries begin to rely on digital signal processing, embedded processing, and image processing. As the demand for these applications increases, so too will the demand for the chip model. Additionally, as the technology advances and becomes more sophisticated, the chip model will be able to handle more complex tasks, making it even more attractive to companies.
The chip model XC3090-50PG175I can be used in a variety of intelligent scenarios, such as networks and machine learning. In networks, the chip model can be used to improve the performance of routers and switches, as well as to provide more secure connections. In machine learning, the chip model can be used to improve the accuracy of predictions and to increase the speed of learning. Additionally, the chip model can be used in the era of fully intelligent systems, as it is capable of handling complex tasks that require a high degree of accuracy and performance.
In conclusion, the chip model XC3090-50PG175I is a high-performance integrated circuit that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be highly reliable, efficient, and cost-effective, making it an attractive choice for many industries. Additionally, it can be used in a variety of intelligent scenarios, such as networks and machine learning, and it is capable of handling complex tasks in the era of fully intelligent systems. Therefore, the chip model XC3090-50PG175I is expected to be in high demand in the future, as more industries begin to rely on digital signal processing, embedded processing, and image processing.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||