AMD Xilinx
XC3090-50PG175C
XC3090-50PG175C ECAD Model
XC3090-50PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 9000 | |
| Number of CLBs | 320 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 9000 GATES | |
| Additional Feature | MAX 144 I/OS; 928 FLIP-FLOPS | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.5052 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-50PG175C Datasheet Download
XC3090-50PG175C Overview
The XC3090-50PG175C is a chip model developed by Xilinx, Inc. It is a field-programmable gate array (FPGA) that is used for a variety of applications. It has been designed to be a reliable and cost-effective solution for system designers.
The XC3090-50PG175C chip model was designed with the intention of providing a flexible, high-performance solution for system designers. It is designed to be easy to use and provide a wide range of features. The chip model is capable of supporting multiple clock frequencies and features a wide range of I/O capabilities. It also has a rich set of features for system designers, including a wide range of memory options, configurable I/O, and support for multiple protocols.
The XC3090-50PG175C chip model has been designed to be used in a variety of applications, including communication systems, robotics, and embedded systems. It is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip model is also capable of supporting a variety of robotic applications, including navigation, sensing, and control.
The XC3090-50PG175C chip model is capable of being upgraded in the future. It can be upgraded to support new protocols and features, or to provide increased performance. The chip model is also capable of being used in advanced communication systems, such as 5G networks.
The XC3090-50PG175C chip model can be used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of features, including navigation, sensing, and control. To use the chip model effectively, it is important to have a good understanding of the architecture of the chip model and the capabilities of the FPGA. In addition, it is important to have a good understanding of the protocols and features that are supported by the chip model.
Overall, the XC3090-50PG175C chip model is a reliable and cost-effective solution for system designers. It is capable of supporting a wide range of applications and features, and can be upgraded in the future. It is also capable of being used in the development and popularization of future intelligent robots, and requires a good understanding of the architecture of the chip model and the protocols and features that it supports.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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