AMD Xilinx
XC3090-50PG175B
XC3090-50PG175B ECAD Model
XC3090-50PG175B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 14 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3090-50PG175B Datasheet Download
XC3090-50PG175B Overview
The chip model XC3090-50PG175B is an advanced integrated circuit (IC) developed by Xilinx, a leading provider of programmable logic solutions. This model is designed to provide high performance, low power consumption, and high integration for a wide range of applications. It is suitable for applications such as communications, consumer electronics, industrial automation, medical, aerospace, and automotive.
The XC3090-50PG175B chip model has several advantages. It is capable of providing high performance, low power consumption, and high integration. It can be used to develop complex systems with multiple functionalities. Furthermore, the XC3090-50PG175B chip model has an optimized architecture that allows the integration of multiple functions in a single chip. This makes it suitable for applications that require high performance and low power consumption.
The demand for the XC3090-50PG175B chip model is expected to grow in the future as new technologies and applications emerge. This is because the chip model is capable of providing high performance and low power consumption, which are essential for the development of advanced systems. Furthermore, the chip model is well-suited for applications such as communications, consumer electronics, industrial automation, medical, aerospace, and automotive.
The XC3090-50PG175B chip model can be applied to the development and popularization of future intelligent robots. This is because the chip model is capable of providing high performance and low power consumption. Furthermore, the chip model is well-suited for applications such as communications, consumer electronics, industrial automation, medical, aerospace, and automotive. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed.
In conclusion, the XC3090-50PG175B chip model is an advanced integrated circuit that is capable of providing high performance, low power consumption, and high integration. The demand for this model is expected to grow in the future as new technologies and applications emerge. Furthermore, the chip model can be applied to the development and popularization of future intelligent robots. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed.
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|---|---|---|
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