AMD Xilinx
XC3090-125PP175C
XC3090-125PP175C ECAD Model
XC3090-125PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-125PP175C Datasheet Download
XC3090-125PP175C Overview
The XC3090-125PP175C chip model is an advanced integrated circuit (IC) designed for use in digital signal processing, embedded processing, and image processing applications. It is capable of delivering high-performance, reliable results with minimal power consumption. The chip model is based on a field programmable gate array (FPGA) architecture, and requires the use of hardware description language (HDL) for programming.
The XC3090-125PP175C chip model is designed to meet the needs of various industries and applications, including telecommunications, automotive, aerospace, and consumer electronics. It offers a wide range of features and benefits, including high-speed signal processing, low-power consumption, and the ability to support a variety of programming languages. Additionally, the chip model is designed to be compatible with a variety of software platforms, making it a versatile choice for many applications.
The XC3090-125PP175C chip model is designed for maximum efficiency and performance, and provides an ideal solution for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is capable of processing signals at up to 125 MHz with a power consumption of only 1.75 watts. Furthermore, the chip model is designed to be compatible with multiple software development platforms, allowing for the efficient development of applications.
In addition to its features and benefits, the XC3090-125PP175C chip model is also designed to be cost-effective. It is available in a variety of packages ranging from small to large, allowing for a cost-effective solution for any application. Furthermore, the chip model is designed to be compatible with a variety of programming languages, making it an ideal choice for developers looking for a versatile solution.
When designing applications for the XC3090-125PP175C chip model, it is important to consider the specific design requirements of the application. For example, when designing a digital signal processing application, it is important to consider the signal bandwidth, the clock speed, and the power consumption of the chip model. Additionally, it is important to consider the specific programming language and software platform that will be used for the application.
In terms of the expected demand for the XC3090-125PP175C chip model in the future, it is expected to remain strong as the chip model is designed to meet the needs of a variety of industries and applications. Additionally, the chip model is designed to be cost-effective and compatible with multiple programming languages, making it an ideal choice for developers looking for a versatile solution.
To conclude, the XC3090-125PP175C chip model is an advanced integrated circuit designed for use in digital signal processing, embedded processing, and image processing applications. It is capable of delivering high-performance, reliable results with minimal power consumption and is designed to be cost-effective and compatible with multiple programming languages. When designing applications for the chip model, it is important to consider the specific design requirements of the application, as well as the expected demand for the chip model in the future.
You May Also Be Interested In
4,207 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $85.6552 | $85.6552 |
| 10+ | $84.7342 | $847.3421 |
| 100+ | $80.1291 | $8,012.9088 |
| 1000+ | $75.5240 | $37,761.9840 |
| 10000+ | $69.0768 | $69,076.8000 |
| The price is for reference only, please refer to the actual quotation! | ||