AMD Xilinx
XC3090-125PG175C
XC3090-125PG175C ECAD Model
XC3090-125PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-125PG175C Datasheet Download
XC3090-125PG175C Overview
The XC3090-125PG175C chip model is a high-performance digital signal processor designed for embedded processing and image processing applications. It is capable of executing complex operations with precision and speed, making it an ideal choice for modern applications. The chip model requires the use of HDL language, which is a powerful and versatile language for developing digital systems.
In terms of industry trends, the XC3090-125PG175C chip model is well-suited for a variety of applications. It is capable of handling high-speed data processing, communication protocols, and other complex tasks. As technology advances, the chip model can be used to develop new applications and products that require more processing power and speed.
The XC3090-125PG175C chip model can also be used in the development and popularization of future intelligent robots. The chip model is capable of performing complex operations quickly, making it an ideal choice for robotic applications. In addition, the chip model can be used to develop sophisticated algorithms for navigation, object recognition, and other tasks. To use the model effectively, engineers and developers need to have a strong understanding of HDL language and robotics.
Overall, the XC3090-125PG175C chip model is a powerful and versatile digital signal processor that is suitable for a variety of applications. It is capable of executing complex operations with precision and speed, making it an ideal choice for modern applications. It is also suitable for the development and popularization of future intelligent robots, and engineers and developers need to have a strong understanding of HDL language and robotics to use the model effectively.
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1,627 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $293.3342 | $293.3342 |
| 10+ | $290.1801 | $2,901.8005 |
| 100+ | $274.4094 | $27,440.9397 |
| 1000+ | $258.6387 | $129,319.3710 |
| 10000+ | $236.5598 | $236,559.8250 |
| The price is for reference only, please refer to the actual quotation! | ||