
AMD Xilinx
XC3090-100PP175I
XC3090-100PP175I ECAD Model
XC3090-100PP175I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 144 | |
Number of Outputs | 144 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
Clock Frequency-Max | 100 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PPGA-P175 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 175 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | PGA | |
Package Equivalence Code | PGA176,16X16MOD | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 42.164 mm | |
Length | 42.164 mm | |
Seated Height-Max | 3.937 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA176,16X16MOD | |
Pin Count | 175 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3090-100PP175I Datasheet Download
XC3090-100PP175I Overview
The chip model XC3090-100PP175I is one of the most advanced models of its kind, designed to provide an efficient and reliable solution for the ever-evolving needs of modern communication systems. Developed by the renowned electronics company Xilinx, the chip model XC3090-100PP175I is a high-performance, low-power programmable device that is capable of handling a wide range of applications.
The original design intention of the chip model XC3090-100PP175I was to provide a reliable and efficient solution for communication needs. It has the capability to support a wide range of applications, including voice and data networks, wireless networks, and video streaming. It is also designed to be highly scalable and can be easily upgraded to meet the changing needs of the communication system.
The chip model XC3090-100PP175I is also capable of being used in advanced communication systems. It is equipped with a powerful processor and a variety of peripherals that enable it to handle complex tasks. It is also capable of supporting the latest communication technologies such as 4G/5G, Wi-Fi, Bluetooth, and Zigbee. Furthermore, it can be used in the era of fully intelligent systems, allowing it to be used in a variety of intelligent scenarios.
The product description and specific design requirements of the chip model XC3090-100PP175I are detailed in the product manual. It provides an overview of the features and specifications of the device and outlines the design requirements for the chip model. The manual also provides actual case studies and precautions that should be taken when using the chip model in order to ensure its optimal performance.
In conclusion, the chip model XC3090-100PP175I is a powerful, efficient, and reliable device that is designed to meet the needs of modern communication systems. It is capable of being used in advanced communication systems and can be used in a variety of intelligent scenarios. Furthermore, the product manual provides detailed product description and design requirements, as well as actual case studies and precautions.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $22.3200 | $22.3200 |
10+ | $22.0800 | $220.8000 |
100+ | $20.8800 | $2,088.0000 |
1000+ | $19.6800 | $9,840.0000 |
10000+ | $18.0000 | $18,000.0000 |
The price is for reference only, please refer to the actual quotation! |