AMD Xilinx
XC3090-100PP175C
XC3090-100PP175C ECAD Model
XC3090-100PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PGA, PGA176,16X16MOD | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | PGA | |
| Pin Count | 175 |
XC3090-100PP175C Datasheet Download
XC3090-100PP175C Overview
The XC3090-100PP175C chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language and is a great tool for those looking to create complex systems.
The chip model has been designed with the latest industry trends in mind, making it a great choice for those looking to stay ahead of the competition. It is capable of handling the most demanding tasks, making it the ideal choice for those looking to create advanced communication systems. The chip model is also upgradeable, meaning that it can easily be adapted to the ever-changing technology landscape.
The XC3090-100PP175C chip model was designed with the intention of creating a powerful processor that can handle complex tasks and keep up with the latest industry trends. The chip model is capable of processing large amounts of data quickly and accurately, making it ideal for those looking to create advanced communication systems. It is also upgradeable, meaning that it can easily be adapted to the ever-changing technology landscape.
The XC3090-100PP175C chip model is the perfect choice for those looking to create high-performance digital signal processing, embedded processing, and image processing systems. It is designed to be programmed using the HDL language and is a great tool for those looking to create complex systems. The chip model is capable of handling the most demanding tasks, making it the ideal choice for those looking to create advanced communication systems. The chip model is also upgradeable, meaning that it can easily be adapted to the ever-changing technology landscape. The XC3090-100PP175C chip model is a great choice for those looking to stay ahead of the competition and create powerful systems that can keep up with the latest industry trends.
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4,533 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.4360 | $23.4360 |
| 10+ | $23.1840 | $231.8400 |
| 100+ | $21.9240 | $2,192.4000 |
| 1000+ | $20.6640 | $10,332.0000 |
| 10000+ | $18.9000 | $18,900.0000 |
| The price is for reference only, please refer to the actual quotation! | ||