AMD Xilinx
XC3090-100PG175I
XC3090-100PG175I ECAD Model
XC3090-100PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-100PG175I Datasheet Download
XC3090-100PG175I Overview
The XC3090-100PG175I chip model is a cutting-edge product released by a leading semiconductor manufacturer, offering a range of features and capabilities that make it a must-have for any modern network. It is designed to provide a high level of performance and reliability, while also being easy to integrate into existing systems.
The XC3090-100PG175I chip model is designed to meet the needs of modern networks, offering a range of features that make it suitable for a wide range of applications. It supports a variety of technologies, including advanced processing capabilities, high-speed data transmission, and advanced encryption. It also has a range of features that make it suitable for use in a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and robotics.
The XC3090-100PG175I chip model is also designed to be highly reliable and secure, offering a range of features that make it suitable for use in highly sensitive applications. It supports a range of security protocols, including advanced encryption, authentication, and access control. It also has a range of features that make it suitable for use in highly secure networks, such as military and government networks.
The XC3090-100PG175I chip model is also designed to be highly efficient, offering a range of features that make it suitable for use in a wide range of applications. It supports a range of power-saving features, such as dynamic voltage scaling and dynamic frequency scaling, which allow it to adjust its power consumption in order to meet the needs of the application. It also has a range of features that make it suitable for use in a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and robotics.
In terms of industry trends, the XC3090-100PG175I chip model is being used in a wide range of applications, including communications, security, and industrial automation. It is also being used in a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and robotics. As the demand for intelligent systems continues to grow, the XC3090-100PG175I chip model is likely to become even more popular.
In terms of design requirements, the XC3090-100PG175I chip model is designed to meet a range of requirements, including performance, reliability, security, power efficiency, and cost. It is also designed to be highly reliable and secure, offering a range of features that make it suitable for use in highly sensitive applications.
In terms of actual case studies, the XC3090-100PG175I chip model has been used in a range of applications, including communications, security, and industrial automation. It has also been used in a range of intelligent scenarios, such as machine learning, artificial intelligence, and robotics. In addition, it has been used in a range of applications that require high levels of security, such as military and government networks.
In terms of precautions, it is important to ensure that the XC3090-100PG175I chip model is being used in an appropriate environment. It should be used in an environment that is free from interference and has adequate power supply. It should also be used in an environment that is free from excessive heat and humidity. In addition, it should be used in an environment that is free from dust, dirt, and other contaminants.
Overall, the XC3090-100PG175I chip model is a cutting-edge product released by a leading semiconductor manufacturer, offering a range of features and capabilities that make it a must-have for any modern network. It is designed to provide a high level of performance and reliability, while also being easy to integrate into existing systems. It is designed to meet the needs of modern networks, offering a range of features that make it suitable for a wide range of applications. It is also designed to be highly reliable and secure, offering a range of features that make it suitable for use in highly sensitive applications. In terms of industry trends, the XC3090-100PG175I chip model is being used in a wide range of applications, including communications, security, and industrial automation. As the demand for intelligent systems continues to grow, the XC3090-100PG175I chip model is likely to become even more popular.
You May Also Be Interested In
5,061 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||