AMD Xilinx
XC3090-100PG175C
XC3090-100PG175C ECAD Model
XC3090-100PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA176,16X16MOD | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090-100PG175C Datasheet Download
XC3090-100PG175C Overview
The XC3090-100PG175C chip model is a highly advanced integrated circuit that has been developed to meet the ever-growing demands of the modern world. This chip model is designed to provide a reliable and efficient solution for a wide range of applications, from consumer electronics to industrial robotics. It is capable of handling complex tasks and can be used in a variety of ways.
The XC3090-100PG175C chip model has a number of advantages over other chip models. It has a low power consumption and is highly reliable. It is also highly efficient and can process data quickly. Furthermore, it has a wide range of features that make it suitable for a variety of applications.
The XC3090-100PG175C chip model is expected to be in high demand in the near future. This is due to the fact that it is a highly advanced chip model that can be used in a variety of applications. It is expected to be used in consumer electronics, industrial robotics, and even in advanced communication systems.
The XC3090-100PG175C chip model is highly modular and can be easily upgraded. This makes it suitable for use in the development and popularization of future intelligent robots. It is also capable of handling complex tasks, which makes it suitable for use in advanced communication systems.
In order to effectively use the XC3090-100PG175C chip model, it is important to have a good understanding of the chip model and its features. It is also important to have a good understanding of the different types of applications that the chip model can be used for. It is also important to have the necessary technical skills and knowledge to be able to use the chip model effectively.
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4,333 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $59.5200 | $59.5200 |
| 10+ | $58.8800 | $588.8000 |
| 100+ | $55.6800 | $5,568.0000 |
| 1000+ | $52.4800 | $26,240.0000 |
| 10000+ | $48.0000 | $48,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||