AMD Xilinx
XC2VP7-7FG456I
XC2VP7-7FG456I ECAD Model
XC2VP7-7FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 248 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 11088 | |
| Number of CLBs | 1232 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1232 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP7-7FG456I Datasheet Download
XC2VP7-7FG456I Overview
The Xilinx XC2VP7-7FG456I chip model is a powerful and reliable device that has been widely used in the industry. It is a field-programmable gate array (FPGA) designed to provide a high-performance, low-power solution to a range of applications. With its advanced features and capabilities, it has become the go-to choice for many customers in various industries.
The XC2VP7-7FG456I chip model is capable of handling a wide range of tasks, from network routing and switching to data processing and storage. It also supports a variety of communication protocols, including Ethernet, USB, and Serial RapidIO. This makes it an ideal choice for applications that require high-speed data transfer and processing.
The chip model is also equipped with a range of features that make it suitable for use in intelligent scenarios. It supports a wide range of intelligent algorithms, such as artificial neural networks and deep learning. It also has the capability to process large amounts of data quickly and accurately, making it ideal for use in intelligent applications.
In addition, the chip model is designed to be highly customizable. It can be programmed to meet the specific requirements of a particular application. This makes it suitable for applications that require specific design parameters, such as those related to the Internet of Things (IoT).
The XC2VP7-7FG456I chip model is also designed to be highly reliable and secure. It is equipped with a range of security features, such as encryption, authentication, and data integrity protection. This makes it suitable for use in secure networks and applications.
In order to help customers better understand the features and capabilities of the XC2VP7-7FG456I chip model, Xilinx provides detailed product descriptions and design requirements. It also provides actual case studies and best practices to ensure that customers are able to make the most of the chip model.
In conclusion, the XC2VP7-7FG456I chip model is a powerful and reliable device that is suitable for a wide range of applications. Its advanced features and capabilities make it suitable for use in intelligent scenarios, secure networks, and applications related to the Internet of Things. With its detailed product descriptions and design requirements, customers can make the most of the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||