AMD Xilinx
XC2VP2-7FG456I
XC2VP2-7FG456I ECAD Model
XC2VP2-7FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 156 | |
| Number of Outputs | 156 | |
| Number of Logic Cells | 3168 | |
| Number of CLBs | 352 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 352 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP2-7FG456I Datasheet Download
XC2VP2-7FG456I Overview
The XC2VP2-7FG456I chip model is a cutting-edge product in the semiconductor industry. It is based on the Xilinx Virtex-II Pro FPGA family and is a high-performance, low-power, high-density FPGA. The chip model has several advantages that make it a top choice for many industries.
The XC2VP2-7FG456I chip model has a large capacity and high speed, allowing it to process complex data quickly. It is also very energy efficient and can be used in various applications, making it suitable for a wide range of industries. The chip model is also highly reliable and has a long life span.
The demand for the XC2VP2-7FG456I chip model is expected to grow in the future, as the need for high-performance, low-power, and high-density FPGA products continues to increase. The chip model is suitable for a variety of industries, including aerospace, automotive, medical, and consumer electronics.
Case studies have shown that the XC2VP2-7FG456I chip model is an effective solution for many applications. It has been used in a variety of projects, including the development and deployment of autonomous robots and unmanned aerial vehicles. The chip model has also been used in the development of artificial intelligence and machine learning algorithms.
When using the XC2VP2-7FG456I chip model, it is important to pay attention to the design requirements and precautions. It is important to ensure that the design meets the specific requirements of the application, as this will ensure the best performance and reliability. Additionally, it is important to be aware of the power consumption of the chip model, as this can have a significant impact on the performance and reliability of the product.
The XC2VP2-7FG456I chip model can be used in the development and popularization of future intelligent robots. It is suitable for a variety of applications, such as autonomous robots and unmanned aerial vehicles. To use the model effectively, it is important to have a good understanding of the design requirements and the power consumption of the chip model. Additionally, it is important to have a good knowledge of artificial intelligence, machine learning, and other related technologies.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||