XC2VP40-7FG676I
XC2VP40-7FG676I
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rohs

AMD Xilinx

XC2VP40-7FG676I


XC2VP40-7FG676I
F20-XC2VP40-7FG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FBGA-676
1 MM PITCH, FBGA-676

XC2VP40-7FG676I ECAD Model


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XC2VP40-7FG676I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 43632
Number of CLBs 4848
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 4848 CLBS
Clock Frequency-Max 1.35 GHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP40-7FG676I Datasheet Download


XC2VP40-7FG676I Overview



The chip model XC2VP40-7FG676I is a programmable logic device designed by Xilinx and is the latest in the Xilinx Virtex II Pro series. It is a field-programmable gate array (FPGA) that integrates numerous features into a single chip, including an array of programmable logic blocks, embedded memory blocks, and a variety of I/O blocks. It is designed to support high-speed data transfer and signal processing applications.


The XC2VP40-7FG676I is a high-performance FPGA that offers superior performance and flexibility. It has a wide range of applications, including high-speed data transfer, signal processing, and communication systems. It is suitable for applications such as digital signal processing, embedded systems, and high-speed networking. The device also features an embedded PowerPC processor, which allows for the development of more advanced applications.


The XC2VP40-7FG676I is designed to be compatible with the latest industry standards, such as PCI Express, Gigabit Ethernet, USB 3.0, and Serial RapidIO. It also supports multiple clock domains and has the ability to switch between multiple clock frequencies. This allows for faster data transfer and signal processing. Additionally, the device supports a variety of features, such as high-speed transceivers, phase-locked loops, and clock synchronization.


The XC2VP40-7FG676I is designed to be highly reliable and is suitable for use in a variety of applications. It can be used in a variety of communication systems, such as cellular networks, satellite networks, and wireless networks. It is also suitable for use in intelligent systems, such as autonomous vehicles and robots. Additionally, it can be used in the era of fully intelligent systems, such as the Internet of Things.


The XC2VP40-7FG676I is designed to be highly reliable and is suitable for use in a variety of applications. It is designed to be compatible with the latest industry standards and has the ability to switch between multiple clock frequencies. Additionally, it supports a variety of features, such as high-speed transceivers, phase-locked loops, and clock synchronization. By taking advantage of these features, the XC2VP40-7FG676I can be used in a variety of applications, including high-speed data transfer, signal processing, and communication systems. It can also be used in intelligent systems, such as autonomous vehicles and robots, and in the era of fully intelligent systems, such as the Internet of Things. As the industry continues to evolve, the XC2VP40-7FG676I is likely to be a key component in the development of new technologies.



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