XC2VP30-7FG676I
XC2VP30-7FG676I
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rohs

AMD Xilinx

XC2VP30-7FG676I


XC2VP30-7FG676I
F20-XC2VP30-7FG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1 MM PITCH, FBGA-676
1 MM PITCH, FBGA-676

XC2VP30-7FG676I ECAD Model


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XC2VP30-7FG676I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 30816
Number of CLBs 3424
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 3424 CLBS
Clock Frequency-Max 1.35 GHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1 MM PITCH, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP30-7FG676I Datasheet Download


XC2VP30-7FG676I Overview



The XC2VP30-7FG676I chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. This chip is designed to be programmed using HDL (Hardware Description Language) and offers a wide range of potential applications.


This chip model is ideal for use in networks and intelligent scenarios, as it is designed to handle complex tasks with ease. It is capable of performing advanced machine learning tasks, such as image recognition, natural language processing, and autonomous navigation. It can also be used for a variety of other tasks, such as data analysis, data mining, and artificial intelligence.


The XC2VP30-7FG676I chip model has a number of design requirements that must be taken into consideration. It requires a specific voltage and current range, as well as a specific number of pins. It also has specific timing requirements, which must be met in order for the chip to function properly.


When designing a system using the XC2VP30-7FG676I chip model, it is important to consider the actual case studies and precautions. This includes taking into account the environmental conditions in which the chip will be used, such as temperature and humidity, as well as any potential risks associated with the use of the chip. It is also important to ensure that the design is optimized for the specific application and that all safety protocols are followed.


The XC2VP30-7FG676I chip model is an excellent solution for high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks and can be used in a variety of networks and intelligent scenarios. With careful consideration of the design requirements and actual case studies, this chip model can be used in the era of fully intelligent systems.



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