
AMD Xilinx
XC2VP4-6FG256C
XC2VP4-6FG256C ECAD Model
XC2VP4-6FG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 140 | |
Number of Outputs | 140 | |
Number of Logic Cells | 6768 | |
Number of CLBs | 752 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 752 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA256,16X16,40 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2VP4-6FG256C Datasheet Download
XC2VP4-6FG256C Overview
The Xilinx XC2VP4-6FG256C chip model is a game-changer in the field of digital signal processing, embedded processing, and image processing. It is designed to meet the demands of the most advanced applications and is capable of performing complex tasks with ease. The chip model is based on a Virtex-II Pro FPGA architecture and is programmed in HDL language.
The XC2VP4-6FG256C chip model offers a number of advantages over other models in the same class. It offers excellent performance and reliability, and is capable of handling complex tasks with ease. It also provides a high level of flexibility, allowing users to customize their applications to meet specific needs. Additionally, the chip model is designed to be power-efficient, reducing energy costs.
The XC2VP4-6FG256C chip model is expected to become increasingly popular in the coming years, as more and more businesses and industries recognize its potential. Its ability to handle complex tasks, its flexibility, and its power efficiency make it ideal for a wide range of applications. Additionally, its design allows for future upgrades, making it a great long-term investment.
The XC2VP4-6FG256C chip model was designed with advanced communication systems in mind. It is capable of handling high-bandwidth data streams and can be used for advanced applications such as voice over IP, video conferencing, and streaming media. The chip model is also designed to be easily upgradable, making it suitable for future advancements in communication technology.
In conclusion, the XC2VP4-6FG256C chip model is a powerful and flexible solution for digital signal processing, embedded processing, and image processing. It offers excellent performance, reliability, and power efficiency, and is designed to be easily upgradable. It is also capable of handling high-bandwidth data streams, making it suitable for advanced communication systems. As more and more businesses and industries recognize its potential, the XC2VP4-6FG256C chip model is expected to become increasingly popular in the coming years.
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3,925 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $186.7442 | $186.7442 |
10+ | $184.7362 | $1,847.3618 |
100+ | $174.6962 | $17,469.6174 |
1000+ | $164.6562 | $82,328.0820 |
10000+ | $150.6002 | $150,600.1500 |
The price is for reference only, please refer to the actual quotation! |