AMD Xilinx
XC2VP20-7FFG896I
XC2VP20-7FFG896I ECAD Model
XC2VP20-7FFG896I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 2320 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2320 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP20-7FFG896I Datasheet Download
XC2VP20-7FFG896I Overview
The XC2VP20-7FFG896I chip model is an advanced model designed for high-performance digital signal processing, embedded processing, and image processing. It is programmed using the HDL language, which is a high-level programming language designed for digital circuits. With the development of technology, the chip model is expected to be used in more advanced applications.
The chip model is suitable for a variety of applications, such as high-speed digital signal processing and embedded systems. Its flexibility and scalability make it an ideal choice for a range of applications. Moreover, it is also capable of supporting high-performance image processing, making it a great choice for applications such as machine vision and autonomous vehicles.
The chip model is also expected to be used in more advanced applications such as networks and intelligent systems. With the development of artificial intelligence, the chip model can be used to create intelligent systems that can process data quickly and accurately. Furthermore, it can also be used in the era of fully intelligent systems, such as in the Internet of Things (IoT).
In order to keep up with industry trends, the chip model must be supported by new technologies. For example, in order to support image processing, the chip model must be compatible with the latest image processing algorithms. Additionally, it must also be able to support the latest network protocols in order to be used in intelligent systems.
The XC2VP20-7FFG896I chip model is a powerful and versatile model that can be used in a variety of applications. With the development of new technologies, it is expected to be used in more advanced applications such as networks and intelligent systems. In order to keep up with industry trends, the chip model must be supported by new technologies in order to be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||